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25P10AV Datasheet PDF - ST Microelectronics

Part Number 25P10AV
Description M25P10AV
Manufacturers ST Microelectronics 
Logo ST Microelectronics Logo 



Preview ( 51 pages )
		
25P10AV datasheet, circuit
M25P10-A
1 Mbit, serial Flash memory, 50 MHz SPI bus interface
Features
1 Mbit of Flash memory
www.DataSheet4U.comPage Program (up to 256 bytes) in 1.4 ms
(typical)
Sector Erase (256 Kbit) in 0.65 s (typical)
Bulk Erase (1 Mbit) in 1.7 s (typical)
2.3 to 3.6 V single supply voltage
SPI bus compatible serial interface
50 MHz Clock rate (maximum)
Deep Power-down mode 1 µA (typical)
Electronic signatures
– JEDEC standard two-byte signature
(2011h)
– RES instruction, one-byte signature (10h),
for backward compatibility
More than 20 years’ data retention
Packages
– ECOPACK® (RoHS compliant)
SO8 (MN)
150 mil width
VFQFPN8 (MP)
(MLP8)
UFDFPN8 (MB)
2 x 3 mm
December 2007
Rev 11
1/51
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25P10AV equivalent
M25P10-A
List of figures
List of figures
Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 2. SO, VFQFPN and UFDFPN8 connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 3. Bus master and memory devices on the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 4. SPI modes supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Hold condition activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 6. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 7. Write Enable (WREN) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
www.DataSheet4UF.ciogmure 8. Write Disable (WRDI) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 9. Read Identification (RDID) instruction sequence and data-out sequence . . . . . . . . . . . . . 19
Figure 10. Read Status Register (RDSR) instruction sequence and data-out sequence . . . . . . . . . . 21
Figure 11. Write Status Register (WRSR) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 12. Read Data Bytes (READ) instruction sequence and data-out sequence . . . . . . . . . . . . . . 24
Figure 13. Read Data Bytes at Higher Speed (FAST_READ) instruction sequence
and data-out sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 14. Page Program (PP) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 15. Sector Erase (SE) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 16. Bulk Erase (BE) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 17. Deep Power-down (DP) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 18. Release from Deep Power-down and Read Electronic Signature (RES) instruction
sequence and data-out sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 19. Release from Deep Power-down (RES) instruction sequence . . . . . . . . . . . . . . . . . . . . . . 32
Figure 20. Power-up timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 21. AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 22. Serial input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 23. Write Protect Setup and Hold timing during WRSR when SRWD=1 . . . . . . . . . . . . . . . . . 43
Figure 24. Hold timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Figure 25. Output timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Figure 26. SO8 narrow – 8-lead plastic small outline, 150 mils body width, package outline . . . . . . . 45
Figure 27. VFQFPN8 (MLP8) 8-lead very thin fine pitch quad flat package no lead,
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 28. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead,
2 x 3 mm package outline47
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Information Total 51 Pages
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