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PDF MPX5700 Data sheet ( Hoja de datos )
| Número de pieza | MPX5700 | |
| Descripción | INTEGRATED PRESSURE SENSOR | |
| Fabricantes | Motorola Semiconductors | |
| Logotipo |  |
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MPX5700/D
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The MPX5700 series piezoresistive transducer is a state–of–the–art monolithic silicon
pressure sensor designed for a wide range of applications, but particularly those
employing a microcontroller or microprocessor with A/D inputs. This patented, single
element transducer combines advanced micromachining techniques, thin–film metalliza-
tion, and bipolar processing to provide an accurate, high level analog output signal that
is proportional to the applied pressure.
Features
• 2.5% Maximum Error over 0° to 85°C
• Ideally Suited for Microprocessor or Microcontroller–Based Systems
• Available in Differential and Gauge Configurations
• Patented Silicon Shear Stress Strain Gauge
• Durable Epoxy Unibody Element
VS
3
MPX5700
SERIES
INTEGRATED
PRESSURE SENSOR
0 to 700 kPa (0 to 101.5 psi)
0.2 to 4.7 V OUTPUT
BASIC CHIP
CARRIER ELEMENT
CASE 867–08, STYLE 1
X–ducer
SENSING
ELEMENT
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
1 Vout
DIFFERENTIAL
PORT OPTION
CASE 867C–05, STYLE 1
2 PINS 4, 5 AND 6 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
PIN NUMBER
1 Vout 4 N/C
2 Gnd 5 N/C
MAXIMUM RATINGS(1)
Parametrics
vOverpressure (P2 1 Atmosphere)
vBurst Pressure (P2 1 Atmosphere)
Symbol
P1max
P1burst
Value
2800
5000
3 VS 6 N/C
NOTE: Pins 4, 5, and 6 are internal
device connections. Do not connect
Unit to external circuitry or ground. Pin 1
kPa is noted by the notch in the Lead.
kPa
Storage Temperature
Tstg
– 40 to +125
°C
Operating Temperature
TA
– 40 to +125
°C
1. TC = 25°C unless otherwise noted. Maximum Ratings apply to Case 867–08 only.
2. Extended exposure at the specified limits may cause permanent damage or degradation to the device.
3. This sensor is designed for applications where P1 is always greater than, or equal to P2.
Senseon and X–ducer are trademarks of Motorola, Inc.
REV 2
©MMoottoororolal,aInSc.e1n9s97or Device Data
1
1 page  
PACKAGE DIMENSIONS
MPX5700 SERIES
C
B
J
S
R
POSITIVE PRESSURE
(P1)
M
–A–
PIN 1
SEATING
PLANE
–T–
1 2 3 45 6
N
L
G
F
D 6 PL
0.136 (0.005) M T A M
CASE 867–08
ISSUE N
BASIC ELEMENT (A, D)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
INCHES
DIM MIN MAX
A 0.595 0.630
B 0.514 0.534
C 0.200 0.220
D 0.027 0.033
F 0.048 0.064
G 0.100 BSC
J 0.014 0.016
L 0.695 0.725
M 30_NOM
N 0.475 0.495
R 0.430 0.450
S 0.090 0.105
MILLIMETERS
MIN MAX
15.11 16.00
13.06 13.56
5.08 5.59
0.68 0.84
1.22 1.63
2.54 BSC
0.36 0.40
17.65 18.42
30_NOM
12.07 12.57
10.92 11.43
2.29 2.66
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
–T–
SEATING
PLANE
R
N
B
PIN 1
C –P–
G
0.25 (0.010) M T Q M
J
A
U PORT #1
L
POSITIVE
PRESSURE (P1)
V
–Q–
1 2 34 5 6
K
S
D 6 PL
F 0.13 (0.005) M T P S Q S
CASE 867B–04
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 1.145 1.175
B 0.685 0.715
C 0.305 0.325
D 0.027 0.033
F 0.048 0.064
G 0.100 BSC
J 0.014 0.016
K 0.695 0.725
L 0.290 0.300
N 0.420 0.440
P 0.153 0.159
Q 0.153 0.159
R 0.230 0.250
S 0.220 0.240
U 0.910 BSC
V 0.182 0.194
MILLIMETERS
MIN MAX
29.08 29.85
17.40 18.16
7.75 8.26
0.68 0.84
1.22 1.63
2.54 BSC
0.36 0.41
17.65 18.42
7.37 7.62
10.67 11.18
3.89 4.04
3.89 4.04
5.84 6.35
5.59 6.10
23.11 BSC
4.62 4.93
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
PRESSURE SIDE PORTED (AP, GP)
Motorola Sensor Device Data
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet MPX5700.PDF ] | |
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