PDF MC3334 Data sheet ( Hoja de datos )

Número de pieza	MC3334
Descripción	HIGH ENERGY IGNITION CIRCUIT
Fabricantes	Motorola Semiconductors
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No Preview Available ! High Energy Ignition Circuit This device is designed to use the signal from a reluctor type ignition pickup to produce a well controlled output from a power Darlington output transistor. • Very Low Peripheral Component Count • No Critical System Resistors • Wide Supply Voltage Operating Range (4.0 V to 24 V) • Overvoltage Shutdown (30 V) • Dwell Automatically Adjusts to Produce Optimum Stored Energy without Waste • Externally Adjustable Peak Current • Available in Chip and Flip–Chip Form • Transient Protected Inputs and Outputs Order this document by MC3334/D MC3334 MCC3334 MCCF3334 HIGH ENERGY IGNITION CIRCUIT SEMICONDUCTOR TECHNICAL DATA 8 1 P SUFFIX PLASTIC PACKAGE CASE 626 MAXIMUM RATINGS Rating Symbol Value Unit Power Supply Voltage–Steady State Transient 300 ms or less Vbat 24 90 V Output Sink Current–Steady State Transient 300 ms or less IO(Sink) 300 1.0 mA A Junction Temperature Operating Temperature Range Storage Temperature Range TJ(max) 150 TA –40 to +125 Tstg –65 to +150 °C °C °C Power Dissipation, Plastic Package, Case 626 Derate above 25°C PD 1.25 W 10 mW/°C D SUFFIX PLASTIC PACKAGE CASE 751 (SO–8) ORDERING INFORMATION Device Operating Temperature Range Package MC3334P Plastic DIP MC3334D MCC3334 TA = – 40° to +125°C SO–8 Chip MCCF3334 Flip–Chip V Reluctor Pickup 1.35H ts t C1* 470 C2* 0.01 Figure 1. Block Diagram and Typical Application Rbat 300 4.0 Vbat–24 Vdc RA 20k S2 + 5 RL 10k RB + – 20k S1 4 CDwell 0.1 C 3 – + CFilter 0.1 Input Comparator with Hysteresis 6 VCC Power Output & OVP Dwell Reference Buffer Current Limit Sense RDrive 100 Ignition Coil Primary 8.0mH 7 IO *MJ10012 RGain 5.0k 8 IL RD2 100 RD1 35–350 RS 0.075 MC3334 Sense Optional parts for extended transient protection Ground wA 350 V zener clamp is required when using the standard MJ10012. This clamp is not required if a selected version with VCEO(sus) 550 V is used. 2 1 Power Ground MOTOROLA ANALOG IC DEVICE DATA © Motorola, Inc. 1996 Rev 0 1 1 page MC3334 MCC3334 MCCF3334 NOTE 2 85 14 F –A– –B– OUTLINE DIMENSIONS P SUFFIX PLASTIC PACKAGE CASE 626–05 ISSUE K L –T– SEATING PLANE H C J N DK M G 0.13 (0.005) M T A M B M –A– 8 1 5 –B– 4X P 4 D SUFFIX PLASTIC PACKAGE CASE 751–05 (SO–8) ISSUE N 0.25 (0.010) M B M G C –T– 8X D SEATING K PLANE 0.25 (0.010) M T B S A S R X 45 _ M_ J F NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 9.40 10.16 0.370 0.400 B 6.10 6.60 0.240 0.260 C 3.94 4.45 0.155 0.175 D 0.38 0.51 0.015 0.020 F 1.02 1.78 0.040 0.070 G 2.54 BSC 0.100 BSC H 0.76 1.27 0.030 0.050 J 0.20 0.30 0.008 0.012 K 2.92 3.43 0.115 0.135 L 7.62 BSC 0.300 BSC M ––– 10_ ––– 10_ N 0.76 1.01 0.030 0.040 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 4.80 5.00 0.189 0.196 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.18 0.25 0.007 0.009 K 0.10 0.25 0.004 0.009 M 0_ 7_ 0_ 7_ P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019 MOTOROLA ANALOG IC DEVICE DATA 5 5 Page

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