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Número de pieza | CY9C62256 | |
Descripción | 32K x 8 Magnetic Nonvolatile CMOS RAM | |
Fabricantes | Cypress | |
Logotipo | ||
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CY9C62256
32K x 8 Magnetic Nonvolatile CMOS RAM
Features
• 100% form, fit, function-compatible with 32K × 8
micropower SRAM (CY62256)
— Fast Read and Write access: 70 ns
— Voltage range: 4.5V–5.5V operation
— Low power: 330 mW Active; 495 µW standby
— Easy memory expansion with CE and OE features
— TTL-compatible inputs and outputs
— Automatic power-down when deselected
• Replaces 32K × 8 Battery Backed (BB)SRAM, SRAM,
EEPROM, FeRAM or Flash memory
• Data is automatically Write protected during power loss
• Write Cycles Endurance: > 1015 cycles
• Data Retention: > 10 Years
• Shielded from external magnetic fields
• Extra 64 Bytes for device identification and tracking
• Temperature ranges
— Commercial: 0°C to 70°C
— Industrial: – 40°C to 85°C
• JEDEC STD 28-pin DIP (600-mil), 28-pin (300-mil) SOIC,
and 28-pin TSOP-1 packages. Also available in 450-mil
wide (300-mil body width) 28-pin narrow SOIC.
Logic Block Diagram
A11
A10
A9
AAA876
AA32
A1
CE
WE
OE
INPUTBUFFER
Silicon Sig.
512x512
ARRAY
COLUMN
DECODER
POWER
DOWN &
WRITE
PROTECT
Functional Description
The CY9C62256 is a high-performance CMOS nonvolatile
RAM employing an advanced magnetic RAM (MRAM)
process. An MRAM is nonvolatile memory that operates as a
fast read and write RAM. It provides data retention for more
than ten years while eliminating the reliability concerns,
functional disadvantages and system design complexities of
battery-backed SRAM, EEPROM, Flash and FeRAM. Its fast
writes and high write cycle endurance makes it superior to
other types of nonvolatile memory.
The CY9C62256 operates very similarly to SRAM devices.
Memory read and write cycles require equal times. The MRAM
memory is nonvolatile due to its unique magnetic process.
Unlike BBSRAM, the CY9C62256 is truly a monolithic nonvol-
atile memory. It provides the same functional benefits of a fast
write without the serious disadvantages associated with
modules and batteries or hybrid memory solutions.
These capabilities make the CY9C62256 ideal for nonvolatile
memory applications requiring frequent or rapid writes in a
bytewide environment.
The CY9C62256 is offered in both commercial and industrial
temperature ranges.
I/O0
I/O1
I/O2
I/O3
OE
I/O4 A1
A2
I/O5 AA34
I/O6
I/O7
WE
VCAAC56
A7
A8
AAA11901
Pin Configurations
SOIC/DIP
Top View
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
I/O0
II//OO12
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28 VCC
27 WE
26
25
AA43
24 A2
23 A1
22 OE
21 A0
20 CE
19
18
17
II//OO76
I/O5
16 I/O4
15 I/O3
22 21 A0
23 20 CE
24
25
19
18
II//OO76
26
27
28
TSOP I
Top View
17 I/O5
16
15
II//OO43
1
2
(not to scale)
14 GND
13 I/O2
3
4
5
6
12
11
10
9
IIAA//OO114310
7 8 A12
Cypress Semiconductor Corporation • 3901 North First Street • San Jose, CA 95134 • 408-943-2600
Document #: 38-15001 Rev. *E
Revised November 15, 2004
1 page PRELIMINARY
CY9C62256
AC Test Loads and Waveforms
5V
OUTPUT
R1 1800 Ω
5V
OUTPUT
100 pF
INCLUDING
JIG AND
SCOPE
R2
990Ω
(a)
5 pF
INCLUDING
JIG AND
SCOPE
R1 1800 Ω
R2
990Ω
(b)
3.0V
GND
10%
< 5 ns
Equivalent to:
OUTPUT
ALL INPUT PULSES
90%
90%
10%
< 5 ns
THEVENIN EQUIVALENT
639Ω
1.77V
Switching Characteristics Over the Operating Range[7]
CY9C62256-70
Parameter
Description
Min.
Max.
Unit
Read Cycle
tRC
tAA
tOHA
tACE
tDOE
tLZOE
tHZOE
tLZCE
tHZCE
tPU
tPD
Write Cycle[10,11]
Read Cycle Time
Address to Data Valid
Data Hold from Address Change
CE LOW to Data Valid
OE LOW to Data Valid
OE LOW to Low Z[8]
OE HIGH to High Z[8,9]
CE LOW to Low Z[8]
CE HIGH to High Z[8,9]
CE LOW to Power-up
CE HIGH to Power-down
70
70
5
70
35
5
25
5
25
0
70
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tWC Write Cycle Time
70 ns
tSCE CE LOW to Write End
60 ns
tAW Address Set-up to Write End
60 ns
tHA Address Hold from Write End
0 ns
tSA Address Set-up to Write Start
0 ns
tPWE
WE Pulse Width
50 ns
tSD Data Set-up to Write End
30 ns
tHD
tHZWE
tLZWE
Data Hold from Write End
WE LOW to High Z[8, 9]
WE HIGH to Low Z[8]
0 ns
25 ns
5 ns
Notes:
7. Test conditions assume signal transition time of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
IOL/IOH and 100-pF load capacitance.
8. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.
9. tHZOE, tHZCE, and tHZWE are specified with CL = 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage.
10. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. Both signals must be LOW to initiate a write and either signal can
terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write.
11. The minimum write pulse width for write cycle #3 (WE controlled, OE LOW) is the sum of tHZWE and tSD.
Document #: 38-15001 Rev. *E
Page 5 of 11
5 Page PRELIMINARY
CY9C62256
Document History Page
Document Title: CY9C62256 32K x 8 Magnetic Nonvolatile CMOS RAM
Document Number: 38-15001
REV.
Orig. of
ECN NO. Issue Date Change
Description of Change
**
115831 05/29/02
NBP New data sheet
*A
116770 07/25/02
NBP Add state of memory bits at the time of shipment
*B
117612 07/26/02
LJN Minor Change needed to change footer from 38-15003 to 38-15001
*C 208424 SEE ECN NBP Icc, Isb1, Isb2, Non-Operating Shielding Specification, Condition to emulate
Boot PROM functionality
*D 227582 SEE ECN NBP Changed Magnetic Shielding Specification
*E
285756 SEE ECN
NBP Added SNC 28-pin SOIC package and Changed VPFD and tWP specification
Document #: 38-15001 Rev. *E
Page 11 of 11
11 Page |
Páginas | Total 11 Páginas | |
PDF Descargar | [ Datasheet CY9C62256.PDF ] |
Número de pieza | Descripción | Fabricantes |
CY9C62256 | 32K x 8 Magnetic Nonvolatile CMOS RAM | Cypress |
CY9C62256 | 32K X 8 Magnetic Nonvolatile CMOS RAM | Cypress Semiconductor |
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