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PDF MC33269 Data sheet ( Hoja de datos )

Número de pieza MC33269
Descripción 800 mA LOW DROPOUT THREE-TERMINAL VOLTAGE REGULATORS
Fabricantes Motorola Semiconductors 
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1. MC33269






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Advance Information
Low Dropout Positive
Fixed and Adjustable
Voltage Regulators
The MC33269 series are low dropout, medium current, fixed and
adjustable, positive voltage regulators specifically designed for use in low
input voltage applications. These devices offer the circuit designer an
economical solution for precision voltage regulation, while keeping power
losses to a minimum.
The regulator consists of a 1.0 V dropout composite PNP–NPN pass
transistor, current limiting, and thermal shutdown.
3.3 V, 5.0 V, 12 V and Adjustable Versions
Space Saving DPAK, SOP–8 and SOT–223 Power Packages
1.0 V Dropout
Output Current in Excess of 800 mA
Thermal Protection
Short Circuit Protection
Output Trimmed to 1.0% Tolerance
No Minimum Load Requirement for Fixed Voltage Output Devices
Device
ORDERING INFORMATION
Operating
Temperature Range
Package
MC33269D
MC33269DT
MC33269ST
MC33269T
MC33269D–3.3
MC33269DT–3.3
MC33269ST–3.3
MC33269T–3.3
MC33269D–5.0
MC33269DT–5.0
MC33269T–5.0
MC33269ST–5.0
MC33269D–12
MC33269DT–12
MC33269T–12
MC33269ST–12
TJ = – 40° to +125°C
SOP–8
DPAK
SOT–223
Insertion Mount
SOP–8
DPAK
SOT–223
Insertion Mount
SOP–8
DPAK
Insertion Mount
SOT–223
SOP–8
DPAK
Insertion Mount
SOT–223
DEVICE TYPE/NOMINAL OUTPUT VOLTAGE
MC33269D
MC33269DT
MC33269T
MC33269ST
MC33269D–3.3
MC33269DT–3.3
MC33269T–3.3
MC33269ST–3.3
Adj
Adj
Adj
Adj
3.3 V
3.3 V
3.3 V
3.3 V
MC33269D–5.0
MC33269DT–5.0
MC33269T–5.0
MC33269ST–5.0
MC33269D–12
MC33269DT–12
MC33269T–12
MC33269ST–12
5.0 V
5.0 V
5.0 V
5.0 V
12 V
12 V
12 V
12 V
MC33269
800 mA
LOW DROPOUT
THREE–TERMINAL
VOLTAGE REGULATORS
8
1
D SUFFIX
PLASTIC PACKAGE
CASE 751
(SOP–8)
Gnd/Adj 1
2
Vout
3
Vin 4
8 NC
7
Vout
6
5 NC
(Top View)
1
3
DT SUFFIX
PLASTIC PACKAGE
CASE 369A
(DPAK)
1. Gnd/Adj
123
(Top View)
2. Vout
3. Vin
1
ST SUFFIX
PLASTIC PACKAGE
CASE 318E
(SOT–223)
3
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
T SUFFIX
PLASTIC PACKAGE
CASE 221A
1
2
3
Pin: 1. Gnd/Adj
2. Vout
3. Vin
123
(Top View)
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
This document contains information on a new product. Specifications and information herein
arMe OsuTbjOecRt tOo cLhAangAeNwAithLoOut GnotIiCce.DEVICE DATA
© Motorola, Inc. 1997
Rev 4
1

1 page




MC33269 pdf
MC33269
Figure 8. SOP–8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
170 3.2
150 2.8
PD(max) for TA = 50°C
130 2.4
110 Graph represents symmetrical layout 2.0
ÏÏÏÏÏÏÏÏÏÏÏÏÏ90
L
2.0 oz.
Copper
1.6
ÏÏÏÏÏÏÏ70 1.2
L 3.0 mm
50 0.8
RθJA
30 0.4
0 10 20 30 40 50
L, LENGTH OF COPPER (mm)
Figure 9. DPAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
100
Free Air
PD(max) for TA = 50°C
2.4
90 Mounted
2.0
Vertically
80
Minimum
70 Size Pad
60
2.0 oz. Copper
L 1.6
ÏÏÏ 1.2
ÏÏÏL
ÏÏÏÏÏÏ 0.8
50
RθJA
0.4
40 0
0 5.0 10 15 20 25 30
L, LENGTH OF COPPER (mm)
Figure 7. SOT–223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
280 2.50
Free Air
PD(max) for TA = 50°C
240 Mounted
1.25
Vertically
200
Minimum
160 Size Pad
120
2.0 oz. Copper
L 0.83
ÏÏÏÏÏÏL 0.63
ÏÏÏ 0.50
80
RθJA
0.42
40 0.35
0
5.0 10
15
20
25 30
L, LENGTH OF COPPER (mm)
MOTOROLA ANALOG IC DEVICE DATA
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