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What is MAX2208?

This electronic component, produced by the manufacturer "Maxim Integrated", performs the same function as "RF Power Detectors in UCSP".


MAX2208 Datasheet PDF - Maxim Integrated

Part Number MAX2208
Description RF Power Detectors in UCSP
Manufacturers Maxim Integrated 
Logo Maxim Integrated Logo 


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19-2015; Rev 2; 8/02
EVAALVUAAILTAIOBNLEKIT
RF Power Detectors in UCSP
General Description
The MAX2205–MAX2208 wideband (800MHz to 2GHz)
power detectors are ideal for GSM/EDGE (MAX2206),
TDMA (MAX2207), and CDMA (MAX2205/MAX2208)
applications. The MAX2206/MAX2207/MAX2208 take an
RF signal from a directional coupler at the input, and out-
put a highly repeatable voltage. The output voltage
increases monotonically with increasing input power. The
output is compensated for temperature and process
shifts, reducing the worst-case variation to less than
±1dB at full power and ±2.5dB at the lowest power.
The MAX2206 features 40dB dynamic range, making
it ideally suited to GSM/EDGE applications. The
MAX2207 offers reduced current consumption for TDMA
applications. The MAX2205/MAX2208 each have an inte-
grated filter to allow for average power detection of
CDMA signals over a 25dB dynamic range. The
MAX2206/MAX2207/MAX2208 offer internal 50termina-
tion for interfacing with a directional coupler. The
MAX2205 has a high-impedance input to provide a low-
loss resistive tap in CDMA applications. All devices allow
the user to control the averaging time constant externally.
The MAX2205–MAX2208 come in a space-saving 2 2,
0.5mm-pitch UCSP™ and require only three external
components.
Applications
Dual-Band GSM/EDGE Handsets
Dual-Band CDMA/TDMA Handsets
WCDMA Handsets
PA Modules
Features
o Space-Saving 2 2 UCSP Occupies Only 1mm2
o Internal Temperature Compensation Gives ±0.3dB
Detection Accuracy
o No External Filter or Op Amp Required
o Power-Detection Range
40dB (MAX2206)
25dB (MAX2205/MAX2207/2208)
Ordering Information
PART
TEMP RANGE BUMP-PACKAGE
MAX2205EBS
-40°C to +85°C 2 × 2 UCSP*
MAX2206EBS
-40°C to +85°C 2 × 2 UCSP*
MAX2207EBS
-40°C to +85°C 2 × 2 UCSP*
MAX2208EBS
-40°C to +85°C 2 × 2 UCSP*
*Requires solder temperature profile described in the Absolute
Maximum Ratings section.
2 2 UCSP
1.01 mm 1.01 mm
UCSP is a trademark of Maxim Integrated Products, Inc.
Pin Configuration/Functional Diagram/Typical Operating Circuit
TOP VIEW
FROM PA OUTPUT
(MAX2205)
680(MAX2205)
10(MAX2206)
0(MAX2207/MAX2208)
FROM COUPLER/TAP
(MAX2206/MAX2207/MAX2208)
47pF
SHDN LOGIC INPUT
10k(MAX2205)
240(MAX2206/MAX2207/MAX2208)
RFIN/SHDN
(A1)
TEMPERATURE-
COMPENSATED
PEAK
DETECTOR
SHUTDOWN
LOGIC
VCC
(A2)
MAX2205
MAX2206
MAX2207
MAX2208
VCC
27pF
GND OUT
(B1) (B2)
UCSP
CFILTER
(OPTIONAL)
TO ADC
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

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MAX2208 equivalent
RF Power Detectors in UCSP
Applications Information
The MAX2205MAX2208 have internal termination
resistors for use with directional couplers. The applica-
tion circuit is shown in Figure 1. The output of the
detector goes to an op amp in an analog GSM power-
control scheme, or to an ADC in other systems such as
TDMA or discrete-time GSM power control.
The MAX2205 has high-input impedance for use with
high-value resistive tapping from a CDMA power ampli-
fier. This coupling method is the lowest cost and lowest
loss when used with an isolator. The application circuit
is shown in Figure 2. Connect CFILTER from the
MAX2205 output to GND to reduce residual amplitude
ripple. For IS98A reverse channel signal with peak-to-
avg ratio of 3.9dB, a 1.5nF capacitor gives 43mVP-P rip-
ple at 28dBm PA output and 390µs response time. For
CDMA2000 (pilot + DCCH) with peak-to-avg ratio of
5.4dB, the ripple is about 65mVP-P at 26dBm PA output.
The MAX2205 input impedance is listed in Table 1.
Layout
As with any RF circuit, the layout of the MAX2205
MAX2208 circuits affects performance. Use a short
50line at the input with multiple ground vias along the
length of the line. The input capacitor and resistor
should be placed as close to the IC as possible. The
VCC input should be bypassed as close as possible to
the IC with multiple vias connecting the capacitor to
ground. Refer to the MAX2205MAX2208 EV kit data
sheet for a sample layout and details.
UCSP Reliability
The UCSP is a unique package that greatly reduces
board space compared to other packages. UCSP relia-
bility is integrally linked to the users assembly methods,
circuit board material, and usage environment. The user
should closely review these areas when considering
using a UCSP. This form factor might not perform equally
to a packaged product through traditional mechanical
reliability tests. Performance through operating life test
and moisture resistance remains uncompromised, as it
is determined primarily by the wafer-fabrication process.
Mechanical stress performance is a greater considera-
tion for a UCSP. UCSP solder-joint contact integrity must
be considered because the package is attached through
direct solder contact to the users PC board. Testing
done to characterize the UCSP reliability performance
shows that it is capable of performing reliably through
environmental stresses. Results of environmental stress
tests and additional usage data and recommendations
are detailed in the UCSP application note, which can be
found on Maxims website, www.maxim-ic.com.
Chip Information
TRANSISTOR COUNT: 344
COUPLER
PA
50
TO ANT
PA
680
ISOLATOR/
CIRCULATOR
TO ANT
MAX2206
MAX2207
MAX2208
PEAK
DETECTOR
TO ADC
OR OP AMP
Figure 1. MAX2206/MAX2207/MAX2208 Typical Application
Circuit
47pF
MAX2205
PEAK
DETECTOR
TO ADC
CFILTER
Figure 2. MAX2205 Typical Application Circuit
_______________________________________________________________________________________ 5


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