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PDF TDA1013B Data sheet ( Hoja de datos )
| Número de pieza | TDA1013B | |
| Descripción | 4 W audio power amplifier with DC volume control | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
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INTEGRATED CIRCUITS
DATA SHEET
TDA1013B
4 W audio power amplifier with
DC volume control
Product specification
File under Integrated Circuits, IC01
July 1994
1 page  
Philips Semiconductors
4 W audio power amplifier with
DC volume control
Product specification
TDA1013B
CHARACTERISTICS
VP = 18 V; RL = 8 Ω; f = 1 kHz; Tamb = 25 °C; see Fig.10; unless otherwise specified
PARAMETER
CONDITIONS
SYMBOL MIN. TYP.
Supply voltage range
Total quiescent current
Noise output voltage
at maximum gain
at maximum gain
at minimum gain
Total sensitivity
Audio amplifier
note 1
RS = 0 Ω
RS = 5 kΩ
RS = 0 Ω
Po = 2.5 W;
DC control at max. gain
VP
Itot
Vn
Vn
Vn
Vi
10 18
− 25
− 0.5
− 0.6
− 0.25
44 55
Repetitive peak output current
Output power
Total harmonic distortion
Sensitivity
Input impedance (pin 5)
Power bandwidth
THD = 10%; RL = 8 Ω
Po = 2.5 W; RL = 8 Ω
Po = 2.5 W
IORM
Po
THD
Vi
|Zi|
BP
−−
4.0 4.2
− 0.15
100 125
100 200
− 30 to
40 000
DC volume control unit
Gain control range
Signal handling
Sensitivity (pin 6)
Input impedance (pin 8)
Output impedance (pin 6)
THD < 1%;
DC control = 0 dB
Vo = 125 mV;
max. voltage gain
|∆Gv|
Vi
Vi
|Zi|
|Zo|
80 90
1.2 1.7
39 44
23 29
45 60
MAX. UNIT
40 V
60 mA
− mV
1.4 mV
− mV
69 mV
1.5 A
−W
1.0 %
160 mV
500 kΩ
− Hz
− dB
−V
55 mV
35 kΩ
75 Ω
Note to the characteristics
1. Measured in a bandwidth in accordance with IEC 179, curve ‘A’.
July 1994
5
5 Page 
Philips Semiconductors
4 W audio power amplifier with
DC volume control
Product specification
TDA1013B
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 1994
11
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet TDA1013B.PDF ] | |
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