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Número de pieza | UPC8158K | |
Descripción | Single Chip Transceiver Silicon MMIC for PHS | |
Fabricantes | NEC | |
Logotipo | ||
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No Preview Available ! PRELIMINARY DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC8158K
RF UP-CONVERTER WITH AGC FUNCTION + IF QUADRATURE MODULATOR IC
FOR DIGITAL MOBILE COMMUNICATION SYSTEMS
DESCRIPTION
The µPC8158K is a silicon microwave monolithic integrated circuit designed as quadrature modulator for digital
mobile communication systems. This MMIC consists of 0.8 GHz to 1.5 GHz up-converter and 100 MHz to 300 MHz
quadrature modulator which are equipped with AGC and power save functions. This configuration suits to IF
modulation system. The package is 28-pin QFN suitable for high density mounting. The chip is manufactured using
NEC’s. 20 GHz fT silicon bipolar process NESATTM III to realize low power consumption. Consequently the
µPC8158K can contribute to make RF blocks smaller size, higher performance and lower power consumption.
FEATURES
• Supply voltage: VCC = 2.7 to 4.0 V, ICC = 28 mA @ VCC = 3.0 V
• Built-in LPF suppresses spurious multipled by TX local (LO1)
• AGC amplifier is installed in local port of up converter: GCR = 35 dB MIN. @ fout = 1.5 GHz
• Excellent performance: Padj = –65 dBc TYP. @ ∆f = ±50 kHz, EVM = 1.2 % rms TYP.
• External IF filter can be applied between modulator output and up converter input terminal.
APPLICATIONS
• Digital cellular phones (PDC800M, PDC1.5G and so on)
ORDERING INFORMATION
Part Number
µPC8158K-E1
Package
28-pin plastic QFN
(5.1 × 5.5 × 0.95 mm)
Supplying Form
Embossed tape 12 mm wide.
Pin 1 is in pull-out direction.
QTY 2.5 kp/Reel.
Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:
µPC8158K)
Caution Electro-static sensitive device
The information in this document is subject to change without notice.
Document No. P13831EJ1V1DS00 (1st edition)
Date Published January 1999 N CP(K)
Printed in Japan
©
1998
1 page µPC8158K
ELECTRICAL CHARACTERISTICS
Conditions (Unless otherwise specified):
TA = +25 °C, VCC1 = VCC2 = VCC3 = 3.0 V, VPS/VAGC = 2.5 V,
I/Q (DC) = Ib/Qb (DC) = VCC/2 = 1.5 V, VI/Ibin = VQ/Qbin = 500 mVP-P (each), fI/Qin = 2.625 kHz,
π/4DQPSK wave input, transmission rate 42 kbps, filter roll-off α = 0.5,
Modulation Pattern: <0000>
fLO1in = 178.05 MHz, PLO1in = –15 dBm
fLO2in = 1619.05 MHz, PLO2in = –15 dBm
fRFout = 1441 MHz – fI/Qin
Parameter
Symbol
Test Conditions
MIN.
UP-CONVERTER + QUADRATURE MODULATOR TOTAL
Total Circuit Current
Total Circuit Current at Power Save Mode
ICC (TOTAL)
ICC (PS) TOTAL
No input signal
VPS ≤ 0.5 V (Low),
No input signal
23.7
–
Total Output Power 1
PRFout1
VAGC = 2.5 V
–15
Total Output Power 2
PRFout2
VAGC = 1.0 V
–56.5
LO Carrier Leak
LOL
fLOL = fLO1 + fLO2
–
Image Rejection (Side Band Leak)
ImR
–
I/Q 3rd order distortion
IM3 (I/Q)
–
AGC Gain Control Range
GCR
VAGC = 2 V → 1 V
35
Error Vector Magnitude
EVM
MOD Pattern: PN9
–
Adjacent channel interference
Spurious suppression
Padj
Pout (8fLO1)
∆f = ±50 kHz,
MOD Pattern: PN9
fLO1 × 8, fLO1 × 8 (image)Note
–
–
Power Save Rise Time
TPS (Rise)
VPS (Low) → VPS (High)
–
Power Save Fall Time
TPS (Fall)
VPS (High) → VPS (Low)
–
I/Q input impedance
ZI/Q Between pin I/Ib, Q/Qb
80
I/Q input bias current
II/Q Between pin I/Ib, Q/Qb
–
LO1 input VSWR
ZLO1
fLO1 = 100 M to 300 MHz
–
TYP.
28
0.3
–11.5
–52
–40
–40
–50
40
1.2
–65
–70
2
2
200
5
1.5:1
MAX.
37.6
10
–8
–46.5
–30
–30
–30
–
3.0
–60
–65
5
5
–
13
–
Unit
mA
µA
dBm
dBm
dBc
dBc
dBc
dB
%rms
dBc
dBc
µs
µs
kΩ
µA
–
Note Without external LC between Fil1 and Fil2 pin on this frequency conditions.
Spectrum analyzer conditions: VBW = 300 Hz, RBW = 300 Hz.
Remark Electrical characteristics in this document is described for 1.5 GHz system.
Preliminary Data Sheet P13831EJ1V1DS00
5
5 Page µPC8158K
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
µPC8158K
Soldering Method
Soldering Conditions
Infrared Reflow
Partial Heating
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 2, Exposure limitNote: None
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limitNote: None
Recommended Condition
Symbol
IR35-00-2
–
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Preliminary Data Sheet P13831EJ1V1DS00
11
11 Page |
Páginas | Total 12 Páginas | |
PDF Descargar | [ Datasheet UPC8158K.PDF ] |
Número de pieza | Descripción | Fabricantes |
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