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BTA12 Datasheet PDF - ST Microelectronics

Part Number BTA12
Description 12A TRIACS
Manufacturers ST Microelectronics 
Logo ST Microelectronics Logo 



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BTA12 datasheet, circuit
BTA12, BTB12, T12xx
12 A Snubberless™, logic level and standard Triacs
Datasheet - production data
Features
Medium current Triac
Low thermal resistance with clip bonding
Low thermal resistance insulation ceramic
for insulated BTA
High commutation (4Q) or very high
commutation (3Q) capability
BTA series UL1557 certified (file ref: 81734)
Packages are RoHS (2002/95/EC) compliant
Applications
ON/OFF or phase angle function in applications
such as static relays, light dimmers and
appliance motors speed controllers.
The Snubberlessversions (BTA/BTB...W and
T12 series) are especially recommended for use
on inductive loads, because of their high
commutation performance. The BTA series
provide an insulated tab (rated at 2500 VRMS).
Description
Available either in through-hole or surface mount
packages, the BTA12, BTB12 and T12xx Triac
series are suitable for general purpose mains
power AC switching.
Table 1: Device summary
Symbol
T12xx BTA12 BTB12
IT(RMS)
VDRM/VRRM
IGT(Snubberless)
IGT(standard)
12 12
12
600/800
5/10/35/50
- 25/50
February 2017
DocID7473 Rev 10
This is information on a product in full production.
1/13
www.st.com

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BTA12 equivalent
BTA12, BTB12, T12xx
Figure 7: Non-repetitive surge peak on-state
current
Figure 8: Relative variation of gate trigger current,
holding current and latching current versus
junction temperature (typical values)
Figure 9: Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values)
Figure 10: Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values) (TW)
(dI/dt )c [(d V/dt )c] / specified (dI/dt )c
5.0
4.5
4.0
TW
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
(dV/dt)c(V/µs)
1.0 10.0
100.0
Figure 11: Relative variation of critical rate of
decrease of main current versus junction
temperature
Figure 12: Thermal resistance junction to ambient
versus copper surface under tab (printed circuit
board FR4, copper thickness: 35 μm)
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
0
0
Epoxy printed board FR4, eCU= 35 µm
SCu(cm²)
5 10 15 20 25 30 35 40
DocID7473 Rev 10
5/13

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Information Total 13 Pages
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