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What is EC1089B-PCB900?

This electronic component, produced by the manufacturer "ETC", performs the same function as "InGaP HBT Gain Block".


EC1089B-PCB900 Datasheet PDF - ETC

Part Number EC1089B-PCB900
Description InGaP HBT Gain Block
Manufacturers ETC 
Logo ETC Logo 


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EC1089
InGaP HBT Gain Block
The Communications Edge TM
Product Information
Product Features
x 10 – 2500 MHz
x +24 dBm P1dB
x +41 dBm OIP3
x 15.5 dB Gain at 900 MHz
x 12.2 dB Gain at 1900 MHz
x Available in SOT-89 and
lead-free / green SOT-89
Package Styles
x Internally matched to 50 :
Applications
x Mobile Infrastructure
x Final stage amplifiers for
Repeaters
x Defense / Homeland Security
Product Description
The EC1089 is a high dynamic range driver amplifier in a
low-cost surface mount package. The InGaP/GaAs HBT is
able to achieve high performance across a broad range with
+41 dBm OIP3 and +24 dBm of compressed 1dB power. It
is housed in an industry standard SOT-89 SMT package.
The EC1089 is also available in a lead-free/green/RoHS-
compliant SOT-89 package. All devices are 100% RF and
DC tested.
The EC1089 is targeted for use as a driver amplifier in
wireless infrastructure where high linearity and medium
power is required. An internal active bias allows the
EC1089 to maintain high linearity over temperature and
operate directly off a single +5 V supply. This combination
makes the device an excellent candidate for transceiver line
cards in current and next generation multi-carrier 3G base
stations.
Functional Diagram
GND
4
123
RF IN GND RF OUT
EC1089B / EC1089B-G
Specifications (1)
Parameters
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
IS-95A Channel Power
@ -45 dBc ACPR
Noise Figure
Test Frequency
Gain
Output P1dB
Output IP3 (2)
Operating Current Range
Device Voltage
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dBm
dB
MHz
dB
dBm
dBm
mA
V
Min
10
10.5
+40
140
Typ
1900
12.2
15
10
+23.5
+41
+17
5.9
2140
11.5
+23.5
+40
160
+5
Max
2500
175
1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +5 V, , in tuned application circuit.
2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Typical Performance (3)
Parameters
Frequency
S21 - Gain
S11 - Input R.L.
S22 - Output R.L.
Output P1dB
Output IP3
Noise Figure
Supply Bias
Units
MHz
dB
dB
dB
dBm
dBm
dB
Typical
900 1900 2140
15.5 12.2 11.5
-14 -15 -15
-10 -10 -10
+24 +23.5 +23.5
+40 +41 +40
5.1 5.9 5.4
+5 V @ 160 mA
3. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +5 V, I =
160 mA, +25¡ C
Absolute Maximum Rating
Ordering Information
Parameter
Operating Case Temperature
Storage Temperature
RF Input Power (continuous)
Device Voltage
Device Current
Junction Temperature
Rating
-40 to +85 qC
-65 to +150 qC
+18 dBm
+6 V
220 mA
+250 qC
Part No.
EC1089B
EC1089B-G
EC1089B-PCB900
EC1089B-PCB1900
EC1089B-PCB2140
Description
InGaP HBT Gain Block
(leaded SOT-89 Pkg)
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
900 MHz Evaluation Board
1900 MHz Evaluation Board
2140 MHz Evaluation Board
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
WJ Communications, Inc   Phone 1-800-WJ1-4401   FAX: 408-577-6621   e-mail: [email protected]   Web site: www.wj.com
December 2004

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EC1089B-PCB900 equivalent
EC1089
¼ Watt, High Linearity InGaP HBT Amplifier
The Communications Edge TM
Product Information
EC1089B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The component will be marked with an
“1089” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating: Class 1A
Value:
Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235£ C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85q C
Thermal Resistance (1)
149q C / W
Junction Temperature (2)
204q C
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85£ C.
2. This corresponds to the typical biasing condition of +5V,
160 mA at an 85£ C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247£ C.
1000.0
100.0
10.0
1.0
60
MTTF vs. GND Tab Temperature
70 80 90 100 110
Tab Temperature (°C)
120
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com
¤
¤¤
¤
December 2004


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