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What is DAC8248HS?

This electronic component, produced by the manufacturer "Analog Devices", performs the same function as "Dual 12-Bit 8-Bit Byte Double-Buffered CMOS D/A Converter".


DAC8248HS Datasheet PDF - Analog Devices

Part Number DAC8248HS
Description Dual 12-Bit 8-Bit Byte Double-Buffered CMOS D/A Converter
Manufacturers Analog Devices 
Logo Analog Devices Logo 


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a
Dual 12-Bit (8-Bit Byte)
Double-Buffered CMOS D/A Converter
DAC8248
FEATURES
Two Matched 12-Bit DACs on One Chip
12-Bit Resolution with an 8-Bit Data Bus
Direct Interface with 8-Bit Microprocessors
Double-Buffered Digital Inputs
RESET to Zero Pin
12-Bit Endpoint Linearity (؎1/2 LSB) Over Temperature
؉5 V to ؉15 V Single Supply Operation
Latch-Up Resistant
Improved ESD Resistance
Packaged in a Narrow 0.3" 24-Pin DIP and 0.3" 24-Pin
SOL Package
Available in Die Form
PIN CONNECTIONS
24-Pin 0.3" Cerdip (W Suffix),
24-Pin Epoxy DIP (P Suffix),
24-Pin SOL (S Suffix)
APPLICATIONS
Multichannel Microprocessor-Controlled Systems
Robotics/Process Control/Automation
Automatic Test Equipment
Programmable Attenuator, Power Supplies, Window
Comparators
Instrumentation Equipment
Battery Operated Equipment
GENERAL DESCRIPTION
The DAC8248 is a dual 12-bit, double-buffered, CMOS digital-
to-analog converter. It has an 8-bit wide input data port that inter-
faces directly with 8-bit microprocessors. It loads a 12-bit word in
two bytes using a single control; it can accept either a least signifi-
cant byte or most significant byte first. For designs with a 12-bit or
16-bit wide data path, choose the DAC8222 or DAC8221.
The DAC8248’s double-buffered digital inputs allow both
DAC’s analog output to be updated simultaneously. This is par-
ticularly useful in multiple DAC systems where a common
LDAC signal updates all DACs at the same time. A single
RESET pin resets both outputs to zero.
The DAC8248’s monolithic construction offers excellent DAC-
to-DAC matching and tracking over the full operating tempera-
ture range. The DAC consists of two thin-film R-2R resistor
ladder networks, two 12-bit, two 8-bit, and two 4-bit data regis-
ters, and control logic circuitry. Separate reference input and
feedback resistors are provided for each DAC. The DAC8248
(continued on page 4)
FUNCTIONAL BLOCK DIAGRAM
REV. B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700
Fax: 617/326-8703

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DAC8248HS equivalent
DICE CHARACTERISTICS
DAC8248
11. AGND
12. IOUTA
13. RFB A
14. VREF A
15. DGND
16. DB7(MSB)
17. DB6
18. DB5
13. NC
14. DB1
15. DB0(LSB)
16. RESET
17. LSB/MSB
18. DAC A/DAC B
19. LDAC
20. WR
19. DB4
10. DB3
11. DB2
12. NC
21. VDD
22. VREF B
23. RFB B
24. IOUT B
SUBSTRATE (DIE BACKSIDE) IS INTERNALLY
CONNECTED TO VDD.
Die Size 0.124 × 0.132 inch, 16,368 sq. mils
(3.15 × 3.55 mm, 10.56 sq. mm)
WAFER TEST LIMITS @ VDD = +5 V or +15 V, VREF A = VREF B = +10 V, VOUT A = VOUT B = 0 V; AGND = DGND = 0 V; TA = 25؇C.
Parameter
Symbol
Conditions
DAC8248G
Limit
Units
Relative Accuracy
Differential Nonlinearity
Full-Scale Gain Error1
Output Leakage
(IOUT A, IOUT B)
Input Resistance
(VREF A, VREF B)
VREF A, VREF B Input
Resistance Match
Digital Input High
Digital Input Low
Digital Input Current
Supply Current
DC Supply Rejection
(Gain/VDD)
INL
DNL
GFSE
ILKG
RREF
RREF
RREF
VINH
VINL
IIN
IDD
PSR
Endpoint Linearity Error
All Grades are Guaranteed Monotonic
Digital Inputs = 1111 1111 1111
Digital Inputs = 0000 0000 0000
Pads 2 and 24
Pads 4 and 22
VDD = +5 V
VDD = +15 V
VDD = +5 V
VDD = +15 V
VIN = 0 V or VDD; VINL or VINH
All Digital Inputs VINL or VINH
All Digital Inputs 0 V or VDD
VDD = ± 5%
±1
±1
±4
± 50
8/15
±1
2.4
13.5
0.8
1.5
±1
2
0.1
0.002
LSB max
LSB max
LSB max
nA max
kmin/kmax
% max
V min
V min
V max
V max
µA max
mA max
mA max
%/% max
NOTES
1Measured using internal RFB A and RFB B.
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
REV. B
–5–


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