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PDF CXP85400 Data sheet ( Hoja de datos )

Número de pieza CXP85400
Descripción CMOS 8-bit 1-chip Microcomputer
Fabricantes Sony Corporation 
Logotipo Sony Corporation Logotipo



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No Preview Available ! CXP85400 Hoja de datos, Descripción, Manual

CXP85400/85490
CMOS 8-bit 1-chip Microcomputer
Piggyback/
evaluator type
Description
The CXP85400/85490 are CMOS 8-bit 1-chip
microcomputers that serve as both piggyback and
evaluator. The CXP85400/85490 are developed for
evaluating the function of the CXP85452/85460.
Note that CXP85400 corresponds to the fixed font,
and CXP85490 corresponds to the custom font
respectively.
64 pin PSDIP (Ceramic) 64 pin PQFP (Ceramic)
Features
64 pin PSDIP (Ceramic)
Instruction set which supports a wide array of data
types
— 213 types of instructions which include 16-bit
calculations, multiplication and division arithmetic,
and boolean bit operations.
Minimum instruction cycle
0.5µs/8MHz
EPROM
27C512
LCC type 27C512
(Maximum of 60K bytes are available.)
Incorporated RAM capacity
960 bytes
EPROM for custom font (CXP85490 only)
LCC type 27C256, LCC type 27C512
(used volume is 24K bytes)
Peripheral functions
— On-screen display function 12 × 18 dots, 384 types 15 colors, 32 characters × 12 lines
Black frame output half blanking, shadow, background color on full screen/
half blanking
Double scanning mode, jitter elimination circuit
— I2C bus interface
— PWM output
14 bits, 1 channel
8 bits, 8 channels
— Remote control receiving circuit 8-bit pulse measurement counter, 6-stage FIFO
— A/D converter
8 bits, 4 channels, successive approximation system
(conversion time of 20µs/8MHz)
— HSYNC counter
2 channels
— Power supply frequency counter
— Watchdog timer
— Serial I/O
8-bit clock synchronized
— Timers
8-bit timer, 8-bit timer/counter, 19-bit time-base timer
Interrupts
14 factors, 14 vectors multi-interruption possible
Standby mode
Sleep
Package
64-pin ceramic SDIP/QFP
Structure
Silicon gate CMOS IC
Note) Optional mask depends on the type of the CXP85400/85490. Refer to the product list for details.
Purchase of Sony's I2C components conveys a license under the Philips I2C Patent Rights to use these components
in an I2C system, provided that the system conforms to the I2C Standard Specifications as defined by Philips.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E94335B7Z-PS

1 page




CXP85400 pdf
CXP85400
Pin Assignment: Evaluator Mode 2
(Top View) 64 pin PQFP Package
CXP85400/85490
PA1
PA0
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
PD7/EC
64 63 62 61 60 59 58 57 56 55 54 53 52
1
2
3
4
5
6 A6/D6
7 A5/D5
8 A4/D4
9 A3/D3
10 A2/D2
11 A1/D1
12 A0/D0
13 NC
14 RD
15
16
17
18
19
4 3 2 1 32 31 30
5 29
6 28
7 27
8 26
9 25
10 24
11 23
12 22
13 21
14 15 16 17 18 19 20
51
50
49
48
47
A8 46
A9 45
A11 44
NC 43
HALT 42
A10 41
E/P 40
I/T 39
MON 38
37
36
35
34
33
20 21 22 23 24 25 26 27 28 29 30 31 32
PF3/PWM3
PF4/PWM4/SCL0
PF5/PWM5/SCL1
PF6/PWM6/SDA0
PF7/PWM7/SDA1
YM
YS
I
B
G
R
EXLC
XLC
PE0/INT0
PE1/INT1
PE2/AN0
PE3/AN1
PE4/AN2
PE5/AN3
Note) 1. NC (Pin 56) is always connected to VDD.
2. Vss (Pins 26 and 58) are always connected to GND.
3. MP (Pin 55) is always connected to GND.
–5–

5 Page





CXP85400 arduino
Package Outline
Unit: mm
64
64PIN PSDIP (CERAMIC) 750mil
58.9 ± 0.55
33
1
2.54 ± 0.25
32
CXP85400/85490
0.46 ± 0.08
0.9
1.778 ± 0.1
SONY CODE
EIAJ CODE
JEDEC CODE
PSDIP-64C-01
ADIP064-C-0750-A
PACKAGE STRUCTURE
PACKAGE MATERIAL CERAMIC
LEAD TREATMENT
GOLD PLATING
LEAD MATERIAL
42 ALLOY
PACKAGE WEIGHT
16.0g
PIN No. 1 INDEX
INDEX
64
1
18.7 ± 0.5
16.3 ± 0.2
4.5
64PIN PQFP (CERAMIC)
52
51
52
51
PIN No.1 INDEX
64
1
19
20
9.48
11.66
15.58 ± 0.2
33
32
33 19
SONY CODE
EIAJ CODE
JEDEC CODE
32
0.6
0.9
PQFP-64C-L02
AQFP064-C-0000-B
20
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
CERAMIC
GOLD PLATING
42 ALLOY
5.2g
– 11 –

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