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What is BDX54C?

This electronic component, produced by the manufacturer "Power Innovations Limited", performs the same function as "PNP SILICON POWER DARLINGTONS".


BDX54C Datasheet PDF - Power Innovations Limited

Part Number BDX54C
Description PNP SILICON POWER DARLINGTONS
Manufacturers Power Innovations Limited 
Logo Power Innovations Limited Logo 


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Copyright © 1997, Power Innovations Limited, UK
BDX54, BDX54A, BDX54B, BDX54C
PNP SILICON POWER DARLINGTONS
MAY 1989 - REVISED MARCH 1997
q Designed for Complementary Use with
BDX53, BDX53A, BDX53B and BDX53C
q 60 W at 25°C Case Temperature
TO-220 PACKAGE
(TOP VIEW)
q 8 A Continuous Collector Current
q Minimum hFE of 750 at 3 V, 3 A
B
C
E
1
2
3
Pin 2 is in electrical contact with the mounting base.
MDTRACA
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
Collector-base voltage (IE = 0)
RATING
Collector-emitter voltage (IB = 0)
Emitter-base voltage
Continuous collector current
Continuous base current
Continuous device dissipation at (or below) 25°C case temperature (see Note 1)
Continuous device dissipation at (or below) 25°C free air temperature (see Note 2)
Operating junction temperature range
Operating temperature range
Operating free-air temperature range
BDX54
BDX54A
BDX54B
BDX54C
BDX54
BDX54A
BDX54B
BDX54C
NOTES: 1. Derate linearly to 150°C case temperature at the rate of 0.48 W/°C.
2. Derate linearly to 150°C free air temperature at the rate of 16 mW/°C.
SYMBOL
VCBO
VCEO
VEBO
IC
IB
Ptot
Ptot
Tj
Tstg
TA
VALUE
-45
-60
-80
-100
-45
-60
-80
-100
-5
-8
-0.2
60
2
-65 to +150
-65 to +150
-65 to +150
UNIT
V
V
V
A
A
W
W
°C
°C
°C
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1

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BDX54C equivalent
BDX54, BDX54A, BDX54B, BDX54C
PNP SILICON POWER DARLINGTONS
MAY 1989 - REVISED MARCH 1997
MECHANICAL DATA
TO-220
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
TO220
ø
3,96
3,71
see Note B
10,4
10,0
2,95
2,54
4,70
4,20
1,32
1,23
6,6
6,0
15,90
14,55
see Note C
6,1
3,5
0,97
0,61
123
1,70
1,07
2,74
2,34
5,28
4,88
14,1
12,7
0,64
0,41
2,90
2,40
VERSION 1
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTES: A. The centre pin is in electrical contact with the mounting tab.
B. Mounting tab corner profile according to package version.
C. Typical fixing hole centre stand off height according to package version.
Version 1, 18.0 mm. Version 2, 17.6 mm.
VERSION 2
PRODUCT INFORMATION
MDXXBE
5


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BDX54C datasheet


1. - 100V, PNP Complementary Transistor

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