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PDF BGA2717 Data sheet ( Hoja de datos )
| Número de pieza | BGA2717 | |
| Descripción | MMIC wideband amplifier | |
| Fabricantes | NXP Semiconductors | |
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BGA2717
MMIC wideband amplifier
Rev. 02 — 24 September 2004
Product data sheet
1. Product profile
CAUTION
1.1 General description
Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal
matching circuit in a 6-pin SOT363 SMD plastic package.
This device is sensitive to electrostatic discharge (ESD). Therefore care should be taken
during transport and handling.
MSC895
1.2 Features
s Internally matched to 50 Ω
s Wide frequency range (3.2 GHz at 3 dB bandwidth)
s Flat 24 dB gain (±1 dB up to 2.8 GHz)
s −2.5 dBm output power at 1 dB compression point
s Good linearity for low current (IP3out = 10 dBm)
s Low second harmonic; −38 dBc at PD = −40 dBm
s Low noise figure; 2.3 dB at 1 GHz
s Unconditionally stable (K ≥ 2).
1.3 Applications
s LNB IF amplifiers
s Cable systems
s ISM
s General purpose.
1.4 Quick reference data
Table 1:
Symbol
VS
IS
s212
NF
PL(sat)
Quick reference data
Parameter
DC supply voltage
supply current
insertion power gain
noise figure
saturated load power
Conditions
f = 1 GHz
f = 1 GHz
f = 1 GHz
Min Typ Max Unit
- 56V
- 8 - mA
- 24 - dB
- 2.3 - dB
- 1 - dBm
1 page  
Philips Semiconductors
BGA2717
MMIC wideband amplifier
30 mm
PH
30 mm
IN
PHILIPS
OUT
V+
PH
IN
PHILIPS
DUT
C2
C3
C1
OUT
V+
001aab255
Material = FR4; thickness = 0.6 mm, εr = 4.6.
Fig 2. PCB layout and demonstration board showing components.
8.1 Grounding and output impedance
If the grounding is not optimal, the gain becomes less flat and the 50 Ω output matching
becomes worse. If a better output matching to 50 Ω is required, a 12 Ω resistor (R1) can
be placed in series with C3 (see Figure 3). This will significantly improve the output
impedance, at the cost of 1 dB gain and 1 dB output power.
9397 750 13293
Product data sheet
Rev. 02 — 24 September 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
5 of 14
5 Page 
Philips Semiconductors
9. Package outline
Plastic surface mounted package; 6 leads
DB
BGA2717
MMIC wideband amplifier
SOT363
E AX
y
6
54
pin 1
index
12
e1 bp
e
3
wM B
HE v M A
A
A1
Q
Lp
detail X
c
01
scale
2 mm
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
max
bp
c
D
E
e
e1 HE Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30 0.25
0.20 0.10
2.2
1.8
1.35 1.3
1.15
0.65
2.2 0.45 0.25
2.0 0.15 0.15
0.2
0.2
0.1
OUTLINE
VERSION
SOT363
IEC
REFERENCES
JEDEC
EIAJ
SC-88
Fig 14. Package outline; SOT363 (SC-88).
9397 750 13293
Product data sheet
Rev. 02 — 24 September 2004
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
11 of 14
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet BGA2717.PDF ] | |
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