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Número de pieza | BYD53J | |
Descripción | Fast soft-recovery controlled avalanche rectifiers | |
Fabricantes | NXP Semiconductors | |
Logotipo | ||
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No Preview Available ! DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D119
BYD53 series
Fast soft-recovery controlled
avalanche rectifiers
Product specification
Supersedes data of 1996 Sep 18
1998 Dec 04
1 page Philips Semiconductors
Fast soft-recovery controlled
avalanche rectifiers
GRAPHICAL DATA
handbook1, .h0alfpage
IF(AV)
(A)
0.8
MGM267
0.6
0.4
0.2
0
0 40 80 120 160 200
Ttp (°C)
BYD53D to M
a = 1.42; VR = VRRMmax; δ = 0.5.
Switched mode application.
Fig.2 Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
Product specification
BYD53 series
handbook1, .h6alfpage
I F(AV)
(A)
1.2
0.8
MLC303
lead length 10 mm
0.4
0
0 100
BYD53U and V
a = 1.42; VR = VRRMmax; δ = 0.5.
Switched mode application.
T tp (oC)
200
Fig.3 Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
handbook0, .h6alfpage
IF(AV)
(A)
0.4
0.2
MGM266
0.8
handbook, halfpage
I F(AV)
(A)
0.6
0.4
0.2
MLC304
0
0 40 80 120
BYD53D to M
a = 1.42; VR = VRRMmax; δ = 0.5.
Device mounted as shown in Fig. 17.
Switched mode application.
160 200
Tamb (°C)
Fig.4 Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
0
0 100
BYD53U and V
a = 1.42; VR = VRRMmax; δ = 0.5.
Device mounted as shown in Fig. 17.
Switched mode application.
Tamb (oC)
200
Fig.5 Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
1998 Dec 04
5
5 Page Philips Semiconductors
Fast soft-recovery controlled
avalanche rectifiers
PACKAGE OUTLINE
Hermetically sealed glass package;
ImplotecTM(1) technology; axial leaded; 2 leads
k
G1
(2)
D LG
DIMENSIONS (mm are the original dimensions)
UNIT
b
max.
D
max.
G
max.
G1
max.
L
min.
mm 0.81
2.15
3.8
5
28
Notes
1. Implotec is a trademark of Philips.
2. The marking band indicates the cathode.
OUTLINE
VERSION
IEC
SOD81
REFERENCES
JEDEC
EIAJ
Product specification
BYD53 series
SOD81
a
b
L
0 1 2 mm
scale
EUROPEAN
PROJECTION
ISSUE DATE
97-06-20
DEFINITIONS
Data Sheet Status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Dec 04
11
11 Page |
Páginas | Total 12 Páginas | |
PDF Descargar | [ Datasheet BYD53J.PDF ] |
Número de pieza | Descripción | Fabricantes |
BYD53 | Fast soft-recovery controlled avalanche rectifiers | NXP Semiconductors |
BYD53D | Fast soft-recovery controlled avalanche rectifiers | NXP Semiconductors |
BYD53G | Fast soft-recovery controlled avalanche rectifiers | NXP Semiconductors |
BYD53J | Fast soft-recovery controlled avalanche rectifiers | NXP Semiconductors |
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