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PDF SMLE13EC8T Data sheet ( Hoja de datos )
| Número de pieza | SMLE13EC8T | |
| Descripción | LED | |
| Fabricantes | ROHM Semiconductor | |
| Logotipo |  |
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SML-E1x Series
■Features
• EXCELEDTM series
• Compact, Thin size (1.6×0.8mm, t=0.36mm)
LED die position is middle of package.
• LED die consists of 4 elements
• Original device technology enables high brightness and high reliability
■Outline
Data Sheet
■Size
1608 (0603)
1.6×0.8mm (t=0.36mm)
■Dimensions
1.6
1.2
Cathode mark
Color
Type
V
U
DY
M P E B WB
■Recommended Solder Pattern
0.8
0.8
0.85
Terminal
0.8
Tolerance : ±0.1
0.8
PCB Bonding Direction
(unit : mm)
■Specifications
Absolute Maximum Ratings (Ta=25ºC)
Electrical and Optical Characteristics (Ta=25ºC)
Part No.
SML-E12V8W
SML-E12UW
SML-E12U8W
SML-E12DW
SML-E12D8W
SML-E12Y8W
SML-E12M8W
SML-E12P8W
SMLE13EC8T
Emitting Power Forward Peak Forward Reverse
Forward Voltag VF Reverse Current IR Dominant Wavelength λD
Chip Structure
Operating Temp. Storage Temp.
/Chromaticity coordinate(x,y)
Color Dissipation Current Current Voltage
Typ. IF Max. VR Min.*3 Typ. Max.*3 IF
Luminous Intensity IV
Min. Typ. IF
PD(mW) IF(mA) IFP(mA) VR(V) Topr(ºC)
Tstg(ºC)
(V) (mA) (mA) (V) (nm) (nm) (nm) (mA) (mcd) (mcd) (mA)
54 20 100*2
-40 ～ +85 -40 ～ +100 2.2
625 630 635
16 40
Red 62 25 60*1
-30 ～ +85 -40 ～ +85 2.0
619 624 629
36 85
54 20 100*2
-40 ～ +85 -40 ～ +100 2.2
615 620 625
25 63
62
AlGaInP Orange
Yellow
Yellowish green
54
Green
68
25 60*1
-30 ～ +85 -40 ～ +85 2.0
20
5
2.2
20 100*2
-40 ～ +85
-40 ～ +100
10
3.0
603.5 606.5 609.5
20
602 605 608
5 587 590 593
569 572 575
557 560 563
520 527 535
56 150
40 100
25 63
10 25
2.5 6.3
56 120
20
SMLE13BC8T
InGaN Blue
SMLE13WBC8W *4
White
66
33
10 50*2
-40 ～ +85
-40 ～ +85
5
2.9
100
464 470 476
(x,y)(0.30, 0.30)
5
14 40
56 120
5
*1 : Duty 1/5, 200Hz *2 : Duty 1/10, 1kHz *3 : Measurement tolerance:±1nm、*4:Brightness for white color is noted with chromaticity coordinate(x,y).
*EXCELEDTM is ROHM's pending tradmark.
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www.rohm.com
©2016 ROHM Co., Ltd. All rights reserved
1/11
2017.3 - Rev.004
1 page  
[SML-E1x series]
■Viewing Angle
[Data Sheet]
Reference
SCANNING ANGLE (deg)
X-Y
10°
20°
30°
40°
0° 10° 20°
30°
40°
50° 50°
60° 60°
70° 70°
80° 80°
90° 90°
100 50 0 50 100
RELATIVE INTENSITY (%)
SCANNING ANGLE (deg)
X' - Y'
10°
20°
30°
40°
0° 10° 20°
30°
40°
50° 50°
60° 60°
70° 70°
80° 80°
90° 90°
100 50 0 50 100
RELATIVE INTENSITY (%)
SML-E12x8 series
SML-E12 series
X-Y SCANNING ANGLE (deg)
10°
20°
0° 10° 20°
30° 30°
40° 40°
50° 50°
60° 60°
70° 70°
80° 80°
90° 90°
100 50 0 50 100
RELATIVE INTENSITY (%)
SCANNING ANGLE (deg)
X’-Y’
10°
20°
0° 10° 20°
30° 30°
40° 40°
50° 50°
60° 60°
70° 70°
80° 80°
90° 90°
100 50 0 50 100
RELATIVE INTENSITY (%)
SMLE13EC8T
SMLE13BC8T
SMLE13WBC8W
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www.rohm.com
©2016 ROHM Co., Ltd. All rights reserved
5/11
2017.3 - Rev.004
5 Page 
[SML-E1x series]
[Data Sheet]
４－６．Reflow Profile
For reflow profile, please refer to the conditions below:(※)
■Meaning of marks, Conditions
Mark
Meanings
Conditions
Tsmax
Maximum of pre-heating temperature
180℃
Tsmin
Minimum of pre-heating temperature
140℃
ts Time from Tsmin to Tsmax Over 60sec.
TL Reference temperature 230〜260℃
tL Retention time for TL Within 40sec.
TP
Peak temperature
260℃(Max)
tP Time for peak temperature Within 10sec.
ΔTR/Δt Temperature rising rate Under 3℃/sec.
ΔTD/Δt
Temperature decreasing rate Over -3℃/sec.
※Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and
reflow furnaces before using, because stress from circuit boards and temperature variations of reflow
furnaces vary by customer’s own conditions.
４－７．Attention Points in Soldering Operation
This product was developed as a surface mount LED especially suitable for reflow soldering.
So reflow soldering is recommended. In case of implementing manual soldering,
please take care of following points.
①SOLDER USED
Sn-Cu，Sn-Ag-Cu，Sn-Ag-Bi-Cu
②HAND SOLDERING CONDITION
LED products do not contain reinforcement material such as a glass fillers.
So thermal stress by soldering greatly influence its reliability.
Please keep following points for manual soldering.
ITEM
RECOMMENDED CONDITION
Condition ) Temp. of iron top less than
a)
Heating
method
Heating
on
400℃ within 3 sec.
PCB pattern, not direct
to
the
LED. (Fig-1)
b)
Handling after Please handle after the part temp.
soldering goes down to room temp.
Fig-1
SOLDERING IRON
SOLDERING
LAND
４－８．Cleaning after Soldering
Please follow the conditions below if the cleaning is necessary after soldering.
Solvent
We recommend to use alcohols solvent such as, isopropyl alcohols
Temperature
Under 30℃ within 3 minutes
Ultrasonic Cleaning
15W／Below 1 liter (capacity of tank)
Drying
Under 100℃ within 3 minutes
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www.rohm.com
©2016 ROHM Co., Ltd. All rights reserved
11/11
2017.3 - Rev.004
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet SMLE13EC8T.PDF ] | |
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