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PDF ESD7462 Data sheet ( Hoja de datos )

Número de pieza ESD7462
Descripción Ultra-Low Capacitance ESD Protection
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ESD7462, SZESD7462
Ultra-Low Capacitance ESD
Protection
Micro−Packaged Diodes for ESD Protection
The ESD7462 is designed to protect voltage sensitive components
that require ultra−low capacitance from ESD and transient voltage
events. It has industry leading capacitance linearity over voltage
making it ideal for RF applications. This capacitance linearity
combined with the extremely small package and low insertion loss
makes this part well suited for use in antenna line applications for
wireless handsets and terminals.
Features
Industry Leading Capacitance Linearity Over Voltage
Ultra−Low Capacitance: 0.3 pF Typ
Insertion Loss: 0.05 dB at 1 GHz; 0.10 dB at 3 GHz
Low Leakage: < 1 nA Typ
Protection for the following IEC Standards:
IEC61000−4−2 (ESD): Level 4
IEC61000−4−4 (EFT): 40 A −5/50 ns
IEC61000−4−5 (Lightning): 1 A (8/20 ms)
Protection for ISO 10605 (ESD)
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
RF Signal ESD Protection
RF Switching, PA, and Antenna ESD Protection
Near Field Communications
USB 2.0, USB 3.0
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol Value
Unit
IEC 61000−4−2 Contact (Note 1)
IEC 61000−4−2 Air
ISO 10605 Contact (330 pF / 330 W)
ISO 10605 Contact (330 pF / 2 kW)
ISO 10605 Contact (150 pF / 2 kW)
ESD ±18 kV
±18
±13
±29
±30
Total Power Dissipation (Note 2) @ TA = 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
°PD°
RqJA
TJ, Tstg
300
400
−55 to
+150
mW
°C/W
°C
Lead Solder Temperature − Maximum
(10 Second Duration)
TL 260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Non−repetitive current pulse at TA = 25°C, per IEC61000−4−2 waveform.
2. Mounted with recommended minimum pad size, DC board FR−4
www.onsemi.com
X2DFN2
CASE 714AB
MARKING
DIAGRAM
4M
G
4 = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device
Package
Shipping
ESD7462N2T5G
X2DFN2 8000 / Tape &
(Pb−Free)
Reel
SZESD7462N2T5G X2DFN2 8000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
January, 2017 − Rev. 1
1
Publication Order Number:
ESD7462/D

1 page




ESD7462 pdf
ESD7462, SZESD7462
20 10 −20 −10
18 −18
16 8 −16 −8
14 −14
12 6 −12 −6
10 −10
8 4 −8 −4
6 −6
4 2 −4 −2
2 −2
0 00 0
0 10 20 30 40 50 60
0 −10 −20 −30 −40 −50 −60
VC, CLAMPING VOLTAGE (V)
Figure 9. Typical Positive TLP IV Curve
VC, CLAMPING VOLTAGE (V)
Figure 10. Typical Negative TLP IV Curve
NOTE: TLP parameter: Z0 = 50 W, tp = 100 ns, tr = 300 ps, averaging window: t1 = 30 ns to t2 = 60 ns. VIEC is the equivalent voltage
stress level calculated at the secondary peak of the IEC 61000−4−2 waveform at t = 30 ns with 2 A/kV. See TLP description
below for more information.
Transmission Line Pulse (TLP) Measurement
Transmission Line Pulse (TLP) provides current versus
voltage (I−V) curves in which each data point is obtained
from a 100 ns long rectangular pulse from a charged
transmission line. A simplified schematic of a typical TLP
system is shown in Figure 11. TLP I−V curves of ESD
protection devices accurately demonstrate the product’s
ESD capability because the 10s of amps current levels and
under 100 ns time scale match those of an ESD event. This
is illustrated in Figure 12 where an 8 kV IEC 61000−4−2
current waveform is compared with TLP current pulses at
8 A and 16 A. A TLP I−V curve shows the voltage at which
the device turns on as well as how well the device clamps
voltage over a range of current levels.
L
50 W Coax
Cable
S Attenuator
÷
50 W Coax
Cable
10 MW
IM VM
VC DUT
Oscilloscope
Figure 11. Simplified Schematic of a Typical TLP
System
Figure 12. Comparison Between 8 kV IEC 61000−4−2 and 8 A and 16 A TLP Waveforms
www.onsemi.com
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