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PDF MPC8272EC Data sheet ( Hoja de datos )
| Número de pieza | MPC8272EC | |
| Descripción | PowerQUICC II Family Hardware Specifications | |
| Fabricantes | Freescale Semiconductor | |
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Advance Information
MPC8272EC
Rev. 0.2 12/2003
MPC8272
PowerQUICC II™ Family
Hardware Specifications
Freescale Semiconductor, Inc.
This hardware specification contains detailed information on power considerations, DC/AC
electrical characteristics, and AC timing specifications for the MPC8272 family of
devices—the MPC8272, the MPC8248, the MPC8271, and the MPC8247. These devices are
.13µm (HiP7) members of the PowerQUICC II™ family of integrated communications
processors. They include on a single chip a 32-bit PowerPC™core that incorporates memory
management units (MMUs) and instruction and data caches and that implements the PowerPC
instruction set; a modified communications processor module (CPM); and an integrated
security engine (SEC) for encryption (the MPC8272 and the MPC8248 only).
All four devices are collectively referred to throughout this hardware specification as ‘the
MPC8272’ unless otherwise noted. The following topics are addressed:
Topic
Page
Section 1, “Overview”
2
Section 2, “Operating Conditions”
7
Section 3, “DC Electrical Characteristics”
8
Section 4, “Thermal Characteristics”
11
Section 5, “Power Dissipation”
14
Section 6, “AC Electrical Characteristics”
14
Section 7, “Clock Configuration Modes”
22
Section 8, “Pinout”
39
Section 9, “Package”
51
Section 10, “Ordering Information”
53
Section 11, “Document Revision History”
53
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
For More Information On This Product,
Go to: www.freescale.com
1 page  
Freescale Semiconductor, Inc.
Overview
• Universal serial bus (USB) controller
— Supports USB 2.0 full/low rate compatible
— USB host mode
– Supports control, bulk, interrupt, and isochronous data transfers
– CRC16 generation and checking
– NRZI encoding/decoding with bit stuffing
– Supports both 12- and 1.5-Mbps data rates (automatic generation of preamble token and
data rate configuration). Note that low-speed operation requires an external hub.
– Flexible data buffers with multiple buffers per frame
– Supports local loopback mode for diagnostics (12 Mbps only)
— Supports USB slave mode
– Four independent endpoints support control, bulk, interrupt, and isochronous data transfers
– CRC16 generation and checking
– CRC5 checking
– NRZI encoding/decoding with bit stuffing
– 12- or 1.5-Mbps data rate
– Flexible data buffers with multiple buffers per frame
– Automatic retransmission upon transmit error
— Serial DMA channels for receive and transmit on all serial channels
— Parallel I/O registers with open-drain and interrupt capability
— Virtual DMA functionality executing memory-to-memory and memory-to-I/O transfers
— Two fast communication controllers (FCCs) supporting the following protocols:
– 10-/100-Mbit Ethernet/IEEE 802.3 CDMA/CS interface through media independent
interface (MII)
– Transparent
– HDLC—up to T3 rates (clear channel)
– One of the FCCs supports ATM (MPC8272 and MPC8271 only)—full-duplex SAR at 155
Mbps, 8-bit UTOPIA interface 31 Mphys, AAL5, AAL1, AAL2, AAL0 protocols, TM 4.0
CBR, VBR, UBR, ABR traffic types, up to 64-K external connections
— Three serial communications controllers (SCCs) identical to those on the MPC860 supporting
the digital portions of the following protocols:
– Ethernet/IEEE 802.3 CDMA/CS
– HDLC/SDLC and HDLC bus
– Universal asynchronous receiver transmitter (UART)
– Synchronous UART
– Binary synchronous (BiSync) communications
– Transparent
– QUICC multichannel controller (QMC) up to 64 channels
• Independent transmit and receive routing, frame synchronization.
• Serial-multiplexed (full-duplex) input/output 2048-, 1544-, and 1536-Kbps PCM
highways
MOTOROLA
MPC8272 PowerQUICC II™ Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
For More Information On This Product,
Go to: www.freescale.com
5
5 Page 
Freescale Semiconductor, Inc.
Thermal Characteristics
4 Thermal Characteristics
Table 6 describes thermal characteristics. Refer to Table 2 for information on a given device’s package.
Discussions of each characteristic are provided in sections 4.1 through 4.7. For the these discussions, PD =
(VDD × IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers.
Table 6. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Air Flow
Junction-to-ambient—
single-layer board 1
27 Natural convection
RθJA
°C/W
21 1 m/s
Junction-to-ambient—
four-layer board
19 Natural convection
RθJA 16 °C/W
1 m/s
Junction-to-board 2
RθJB 11 °C/W
—
Junction-to-case 3
RθJC 8 °C/W
—
Junction-to-package top 4
RθJT 2 °C/W
—
1 Assumes no thermal vias
2 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
3 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
4 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
4.1 Estimation with Junction-to-Ambient Thermal
Resistance
An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature (ºC)
RθJA = package junction-to-ambient thermal resistance (ºC/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value which provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity TJ – TA) are possible.
MOTOROLA
MPC8272 PowerQUICC II™ Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
For More Information On This Product,
Go to: www.freescale.com
11
11 Page | ||
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| PDF Descargar | [ Datasheet MPC8272EC.PDF ] | |
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