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What is CY7C1393KV18?

This electronic component, produced by the manufacturer "Cypress Semiconductor", performs the same function as "18-Mbit DDR II SIO SRAM Two-Word Burst Architecture".


CY7C1393KV18 Datasheet PDF - Cypress Semiconductor

Part Number CY7C1393KV18
Description 18-Mbit DDR II SIO SRAM Two-Word Burst Architecture
Manufacturers Cypress Semiconductor 
Logo Cypress Semiconductor Logo 


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CY7C1392KV18
CY7C1393KV18
18-Mbit DDR II SIO SRAM
Two-Word Burst Architecture
18-Mbit DDR II SIO SRAM Two-Word Burst Architecture
Features
18-Mbit density (2M × 8, 1M × 18)
333-MHz clock for high bandwidth
Two-word burst for reducing address bus frequency
Double data rate (DDR) interfaces (data transferred at
666 MHz) at 333 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Synchronous internally self timed writes
DDR II operates with 1.5 cycle read latency when DOFF is
asserted HIGH
Operates similar to DDR I device with one cycle read latency
when DOFF is asserted LOW
1.8 V core power supply with HSTL inputs and outputs
Variable drive HSTL output buffers
Expanded HSTL output voltage (1.4 V–VDD)
Supports both 1.5 V and 1.8 V I/O supply
Available in 165-ball FBGA package (13 × 15 × 1.4 mm)
Offered in both Pb-free and non Pb-free packages
JTAG 1149.1 compatible test access port
Phase locked loop (PLL) for accurate data placement
Configurations
CY7C1392KV18 – 2M × 8
CY7C1393KV18 – 1M × 18
Functional Description
The CY7C1392KV18 and CY7C1393KV18 are 1.8 V
Synchronous Pipelined SRAMs, equipped with DDR II SIO
(double data rate separate I/O) architecture. The DDR II SIO
consists of two separate ports: the read port and the write port to
access the memory array. The read port has data outputs to
support read operations and the write port has data inputs to
support write operations. The DDR II SIO has separate data
inputs and data outputs to completely eliminate the need to
‘turnaround’ the data bus required with common I/O devices.
Access to each port is accomplished through a common address
bus. Addresses for read and write are latched on alternate rising
edges of the input (K) clock. Write data is registered on the rising
edges of both K and K. Read data is driven on the rising edges
of C and C if provided, or on the rising edge of K and K if C/C are
not provided. Each address location is associated with two 8-bit
words in the case of CY7C1392KV18 and two 18-bit words in the
case of CY7C1393KV18 that burst sequentially into or out of the
device.
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs are tightly matched to the
two output echo clocks CQ/CQ, eliminating the need to capture
data separately from each individual DDR II SIO SRAM in the
system design. Output data clocks (C/C) enable maximum
system clocking and data synchronization flexibility.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
For a complete list of related documentation, click here.
Selection Guide
Maximum operating frequency
Maximum operating current
Description
333 MHz 300 MHz 250 MHz
333 300 250
× 8 Not Offered Not Offered 370
× 18 450 430 380
Unit
MHz
mA
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 001-58907 Rev. *G
• San Jose, CA 95134-1709 • 408-943-2600
Revised January 19, 2016

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CY7C1393KV18 equivalent
CY7C1392KV18
CY7C1393KV18
Pin Configurations (continued)
The pin configurations for CY7C1392KV18 and CY7C1393KV18 follow. [1]
Figure 1. 165-ball FBGA (13 × 15 × 1.4 mm) pinout
CY7C1393KV18 (1M × 18)
12345678
A
CQ NC/144M NC/36M R/W
BWS1
K NC/288M LD
B NC Q9 D9 A NC K BWS0 A
C NC NC D10 VSS A A A VSS
D NC D11 Q10 VSS VSS VSS VSS VSS
E
NC
NC
Q11
VDDQ
VSS
VSS
VSS
VDDQ
F
NC
Q12
D12
VDDQ
VDD
VSS
VDD
VDDQ
G
NC
D13
Q13
VDDQ
VDD
VSS
VDD
VDDQ
H
DOFF
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
J
NC
NC
D14
VDDQ
VDD
VSS
VDD
VDDQ
K
NC
NC
Q14
VDDQ
VDD
VSS
VDD
VDDQ
L
NC
Q15
D15
VDDQ
VSS
VSS
VSS
VDDQ
M NC NC D16 VSS VSS VSS VSS VSS
N NC D17 Q16 VSS A A A VSS
P NC NC Q17 A A C A A
R
TDO
TCK
A
A
A
C
A
A
9
A
NC
NC
NC
NC
NC
NC
VDDQ
NC
NC
NC
NC
NC
NC
A
10
NC/72M
NC
Q7
NC
D6
NC
NC
VREF
Q4
D3
NC
Q1
NC
D0
TMS
11
CQ
Q8
D8
D7
Q6
Q5
D5
ZQ
D4
Q3
Q2
D2
D1
Q0
TDI
Document Number: 001-58907 Rev. *G
Page 5 of 31


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Featured Datasheets

Part NumberDescriptionMFRS
CY7C1393KV18The function is 18-Mbit DDR II SIO SRAM Two-Word Burst Architecture. Cypress SemiconductorCypress Semiconductor

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