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What is CY7C1352G?

This electronic component, produced by the manufacturer "Cypress Semiconductor", performs the same function as "4-Mbit (256K x 18) Pipelined SRAM".


CY7C1352G Datasheet PDF - Cypress Semiconductor

Part Number CY7C1352G
Description 4-Mbit (256K x 18) Pipelined SRAM
Manufacturers Cypress Semiconductor 
Logo Cypress Semiconductor Logo 


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CY7C1352G
4-Mbit (256K × 18) Pipelined SRAM
with NoBL™ Architecture
4-Mbit (256K × 18) Pipelined SRAM with NoBL™ Architecture
Features
Pin compatible and functionally equivalent to ZBT™ devices
Internally self-timed output buffer control to eliminate the need
to use OE
Byte write capability
256K × 18 common I/O architecture
3.3 V core power supply (VDD)
2.5 V/3.3 V I/O power supply (VDDQ)
Fast clock-to-output times
4.0 ns (for 133-MHz device)
Clock enable (CEN) pin to suspend operation
Synchronous self-timed writes
Asynchronous output enable (OE)
Available in Pb-free 100-pin TQFP package
Burst capability – linear or interleaved burst order
ZZ sleep mode option and stop clock option
Functional Description
The CY7C1352G is a 3.3 V, 256K × 18 synchronous-pipelined
burst SRAM designed specifically to support unlimited true
back-to-back read/write operations without the insertion of wait
states. The CY7C1352G is equipped with the advanced No Bus
Latency™ (NoBL™) logic required to enable consecutive
read/write operations with data being transferred on every clock
cycle. This feature dramatically improves the throughput of the
SRAM, especially in systems that require frequent write/read
transitions.
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. All data outputs pass through output
registers controlled by the rising edge of the clock. The clock
input is qualified by the clock enable (CEN) signal, which, when
deasserted, suspends operation and extends the previous clock
cycle. Maximum access delay from the clock rise is 4.0 ns
(133-MHz device).
Write operations are controlled by the two byte write select
(BW[A:B]) and a write enable (WE) input. All writes are conducted
with on-chip synchronous self-timed write circuitry.
Three synchronous chip enables (CE1, CE2, CE3) and an
asynchronous output enable (OE) provide for easy bank
selection and output tri-state control. In order to avoid bus
contention, the output drivers are synchronously tri-stated during
the data portion of a write sequence.
For a complete list of related documentation, click here.
Selection Guide
Maximum access time
Maximum operating current
Maximum CMOS standby current
Description
133 MHz
4.0
225
40
Unit
ns
mA
mA
Errata: For information on silicon errata, see "Errata" on page 19. Details include trigger conditions, devices affected, and proposed workaround.
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 38-05514 Rev. *O
• San Jose, CA 95134-1709 • 408-943-2600
Revised November 3, 2016

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CY7C1352G equivalent
CY7C1352G
Pin Definitions
Name
A0, A1, A
BW[A:B]
WE
ADV/LD
CLK
CE1
CE2
CE3
OE
CEN
ZZ[2]
DQs
I/O Description
Input- Address inputs used to select one of the 256 K address location. Sampled at the rising edge of the
synchronous CLK. A[1:0] are fed to the two-bit burst counter.
Input- Byte write inputs, active LOW. Qualified with WE to conduct writes to the SRAM. Sampled on the rising
synchronous edge of CLK.
Input- Write enable input, active LOW. Sampled on the rising edge of CLK if CEN is active LOW. This signal
synchronous must be asserted LOW to initiate a write sequence.
Input- Advance/load input. Used to advance the on-chip address counter or load a new address. When HIGH
synchronous (and CEN is asserted LOW) the internal burst counter is advanced. When LOW, a new address can be
loaded into the device for an access. After being deselected, ADV/LD should be driven LOW in order to
load a new address.
Input-clock Clock input. Used to capture all synchronous inputs to the device. CLK is qualified with CEN. CLK is
only recognized if CEN is active LOW.
Input- Chip enable 1 input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE2
synchronous and CE3 to select/deselect the device.
Input- Chip enable 2 input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with CE1
synchronous and CE3 to select/deselect the device.
Input- Chip enable 3 input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE1
synchronous and CE2 to select/deselect the device.
Input- Output enable, asynchronous input, active LOW. Combined with the synchronous logic block inside
asynchronous the device to control the direction of the I/O pins. When LOW, the DQ pins are allowed to behave as
outputs. When deasserted HIGH, DQ pins are tri-stated, and act as input data pins. OE is masked during
the data portion of a write sequence, during the first clock when emerging from a deselected state, when
the device has been deselected.
Input- Clock enable input, active LOW. When asserted LOW the clock signal is recognized by the SRAM.
synchronous When deasserted HIGH the clock signal is masked. Since deasserting CEN does not deselect the device,
CEN can be used to extend the previous cycle when required.
Input- ZZ “sleep” Input. This active HIGH input places the device in a non-time-critical “sleep” condition with
asynchronous data integrity preserved. During normal operation, this pin has to be low or left floating. ZZ pin has an
internal pull-down.
I/O- Bidirectional data I/O lines. As inputs, they feed into an on-chip data register that is triggered by the
synchronous rising edge of CLK. As outputs, they deliver the data contained in the memory location specified by the
address during the clock rise of the read cycle. The direction of the pins is controlled by OE and the
internal control logic. When OE is asserted LOW, the pins can behave as outputs. When HIGH, DQs and
DQP[A:B] are placed in a tri-state condition. The outputs are automatically tri-stated during the data
portion of a write sequence, during the first clock when emerging from a deselected state, and when the
device is deselected, regardless of the state of OE.
Note
2. Errata: The ZZ pin (Pin 64) needs to be externally connected to ground. For more information, see "Errata" on page 19.
Document Number: 38-05514 Rev. *O
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