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What is ZSSC3026?

This electronic component, produced by the manufacturer "IDT", performs the same function as "High Resolution 16-Bit Sensor Signal Conditioner".


ZSSC3026 Datasheet PDF - IDT

Part Number ZSSC3026
Description High Resolution 16-Bit Sensor Signal Conditioner
Manufacturers IDT 
Logo IDT Logo 


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Low Power, High Resolution 16-Bit
Sensor Signal Conditioner
ZSSC3026
Datasheet
Brief Description
The ZSSC3026 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Developed for correction of resistive bridge
sensors and optimized for high-resolution altimeter
module applications, the ZSSC3026 can perform
offset, span, and 1st and 2nd order temperature com-
pensation of the measured signal. It can also provide
a corrected temperature output measured with an
internal sensor. The corrected measurement values
are provided at the digital output pins, which can be
configured as I2C™* (3.4MHz) or SPI (20MHz).
Digital compensation of the signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP) run-
ning a correction algorithm. Calibration coefficients
are stored on-chip in a highly reliable, non-volatile,
multiple-time programmable (MTP) memory. Prog-
ramming the ZSSC3026 is simple via the serial
interface. An internal charge pump provides the
programming voltage. The interface is used for the
PC-controlled calibration procedure, which programs
the calibration coefficients in memory. The digital
mating is fast and precise, eliminating the overhead
normally associated with trimming external com-
ponents and multi-pass calibration routines.
Features
Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing two-
segment analog-to-digital converter (ADC)
Fully programmable gain amplifier for optimizing
sensor signals: gain range 14 to 72 (linear)
Internal auto-compensated temperature sensor
Digital compensation of individual sensor offset;
1st and 2nd order compensation of sensor gain
Digital compensation of 1st and 2nd order tem-
perature gain and offset drift
Intelligent power management unit
Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
Typical sensor elements can achieve accuracy of
better than ±0.10% FSO @ -40 to 85°C
* I2C™ is a registered trademark of NXP.
Benefits
Excellent for low-voltage and low-power battery
applications
Integrated 18-bit calibration math DSP
Costs minimized via one-pass calibration
No external trimming components required
Highly integrated CMOS design
Physical Characteristics
Supply voltage range: 1.8 to 3.6V
Current consumption: 900µA (operating mode)
Sleep State current: 50nA (typical)
Temperature resolution: <0.003K/LSB
Operation temperatures depending on part
number: –40°C to +85°C
Small die size
Delivery options: die for wafer bonding, bumped
die for Flip Chip, PQFN24
Typical Applications
The ZSSC3026 is designed for operation in cali-
brated resistive (e.g., pressure) sensor modules:
Barometric altitude measurement for portable
navigation
Altitude measurement for emergency call
systems and car navigation
Inside hard disk pressure measurement
Weather forecast
Fan control
ZSSC3026 Application Example
© 2016 Integrated Device Technology, Inc.
1
March 28, 2016

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ZSSC3026 equivalent
ZSSC3026
List of Tables
Table 1.1
Table 1.2
Table 1.3
Table 1.4
Table 2.1
Table 2.2
Table 2.3
Table 2.4
Table 2.5
Table 2.6
Table 2.7
Table 2.8
Table 3.1
Table 3.2
Table 3.3
Table 3.4
Table 3.5
Table 3.6
Table 3.7
Table 3.8
Table 4.1
Table 4.2
Table 4.3
Maximum Ratings ............................................................................................................................... 6
Operating Conditions .......................................................................................................................... 6
Constraints for VDD Power-On Reset ................................................................................................ 7
Electrical Parameters.......................................................................................................................... 7
Amplifier Gain: Stage 1..................................................................................................................... 12
Amplifier Gain: Stage 2..................................................................................................................... 13
Gain Polarity ..................................................................................................................................... 13
MSB/LSB Settings ............................................................................................................................ 14
MSB/LSB Segmentation Settings for Temperature Measurement................................................... 14
ADC Conversion Time for a Single A2D Conversion ....................................................................... 15
Typical Conversion Time vs. Noise Performance for 16-Bit Fully Conditioned Signal Results
(AZBM, BM, AZTM, TM, and Digital SSC Correction)...................................................................... 16
ADC Offset Settings.......................................................................................................................... 17
SPI/I2C Commands .......................................................................................................................... 23
Get_Raw Commands ....................................................................................................................... 25
General Status Byte.......................................................................................................................... 26
Status Byte for Read Operations ...................................................................................................... 26
Status Byte for Write Operations ...................................................................................................... 26
Mode Status...................................................................................................................................... 26
Memory Status Word ........................................................................................................................ 33
MTP Memory Content Assignments ................................................................................................. 34
Die Pad Assignments ....................................................................................................................... 46
Physical Package Dimensions.......................................................................................................... 47
Pin Assignments PQFN24 ................................................................................................................ 48
© 2016 Integrated Device Technology, Inc.
5
March 28, 2016


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