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PDF FCB110N65F Data sheet ( Hoja de datos )

Número de pieza FCB110N65F
Descripción MOSFET ( Transistor )
Fabricantes Fairchild Semiconductor 
Logotipo Fairchild Semiconductor Logotipo



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No Preview Available ! FCB110N65F Hoja de datos, Descripción, Manual

August 2016
FCB110N65F
N-Channel SuperFET® II FRFET® MOSFET
650 V, 35 A, 110 mΩ
Features
• 700 V @TJ = 150°C
• Typ. RDS(on) = 96 mΩ (Typ.)
• Ultra Low Gate Charge (Typ. Qg = 98 nC)
• Low Effective Output Capacitance (Typ. Coss(eff.) = 464 pF)
• 100% Avalanche Tested
• RoHS Compliant
Applications
• Telecom/Server Power Supplies • Solar Inverters
• Computing Power Supplies
• FPD TV Power/Lighting
Description
SuperFET® II MOSFET is Fairchild Semiconductor’s brand-new
high voltage super-junction (SJ) MOSFET family that is utilizing
charge balance technology for outstanding low on-resistance
and lower gate charge performance.
SuperFET® II FRFET® MOSFET combines a faster and more
rugged intrinsic body diode performance with fast switching,
aimed at achieving better reliability and efficiency especially in
resonant switching applications.
SuperFET® II FRFET® is very suitable for the switching power
applications such as server/telecom power, Solar inverter, FPD
TV power, computing power, lighting and industrial power appli-
cations.
D
D
G
S
D2-PAK
G
Absolute Maximum Ratings TC = 25oC unless otherwise noted.
Symbol
VDSS
VGSS
ID
IDM
EAS
IAR
EAR
dv/dt
PD
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Drain Current
- DC
- AC
- Continuous (TC = 25oC)
- Continuous (TC = 100oC)
- Pulsed
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
MOSFET dv/dt
Peak Diode Recovery dv/dt
Power Dissipation
(TC = 25oC)
- Derate Above 25oC
TJ, TSTG
TL
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering,
1/8” from Case for 5 Seconds
S
(Note 1)
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Thermal Characteristics
Symbol
RθJC
RθJA
Parameter
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient (Mimimum Pad of 2-oz copper), Max.
Thermal Resistance, Junction to Ambient (1 in2 Pad of 2-oz copper), Max.
©2015 Fairchild Semiconductor Corporation
FCB110N65F Rev. 1.1
1
FCB110N65F
650
±20
±30
35
24
105
809
8
3.57
100
50
357
2.86
-55 to +150
300
Unit
V
V
A
A
mJ
A
mJ
V/ns
W
W/oC
oC
oC
FCB110N65F
0.35
62.5
40
Unit
oC/W
www.fairchildsemi.com

1 page




FCB110N65F pdf
Typical Performance Characteristics (Continued)
Figure 12. Transient Thermal Response Curve
1
0.5
0.1
0.2
0.1
0.05
0.01 0.02
0.01
Single pulse
0.001
10-5
PDM
t1
t2
*Notes:
1. ZθJC(t) = 0.35oC/W Max.
2. Duty Factor, D= t1/t2
3. TJM - TC = PDM * ZθJC(t)
10-4
10-3
10-2
10-1
t1, Rectangular Pulse Duration [sec]
1
©2015 Fairchild Semiconductor Corporation
FCB110N65F Rev. 1.1
5
www.fairchildsemi.com

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