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PDF STM32469VI Data sheet ( Hoja de datos )
| Número de pieza | STM32469VI | |
| Descripción | 32b MCU+FPU | |
| Fabricantes | STMicroelectronics | |
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STM32F469xx
ARM®Cortex®-M4 32b MCU+FPU, 225DMIPS, up to 2MB Flash/384+4KB RAM, USB OTG HS/FS,
Ethernet, FMC, dual Quad-SPI, Graphical accelerator, Camera IF, LCD-TFT & MIPI DSI
Datasheet - production data
Features
• Core: ARM® 32-bit Cortex®-M4 CPU with FPU,
Adaptive real-time accelerator (ART
Accelerator™) allowing 0-wait state execution
from Flash memory, frequency up to 180 MHz,
MPU, 225 DMIPS/1.25 DMIPS/MHz
(Dhrystone 2.1), and DSP instructions
• Memories
– Up to 2 MB of Flash memory organized into two
banks allowing read-while-write
– Up to 384+4 KB of SRAM including 64-KB of
CCM (core coupled memory) data RAM
– Flexible external memory controller with up to
32-bit data bus: SRAM, PSRAM,
SDRAM/LPSDR, SDRAM, Flash NOR/NAND
memories
– Dual-flash mode Quad-SPI interface
• Graphics:
– Chrom-ART Accelerator™ (DMA2D), graphical
hardware accelerator enabling enhanced
graphical user interface with minimum CPU load
– LCD parallel interface, 8080/6800 modes
– LCD TFT controller supporting up to XGA
resolution
– MIPI® DSI host controller supporting up to 720p
30Hz resolution
• Clock, reset and supply management
– 1.7 V to 3.6 V application supply and I/Os
– POR, PDR, PVD and BOR
– 4-to-26 MHz crystal oscillator
– Internal 16 MHz factory-trimmed RC (1%
accuracy)
– 32 kHz oscillator for RTC with calibration
– Internal 32 kHz RC with calibration
• Low power
– Sleep, Stop and Standby modes
– VBAT supply for RTC, 20×32 bit backup registers
+ optional 4 KB backup SRAM
• 3×12-bit, 2.4 MSPS ADC: up to 24 channels
and 7.2 MSPS in triple interleaved mode
• 2×12-bit D/A converters
• General-purpose DMA: 16-stream DMA
controller with FIFOs and burst support
• Up to 17 timers: up to twelve 16-bit and two 32-
bit timers up to 180 MHz, each with up to 4
IC/OC/PWM or pulse counter and quadrature
(incremental) encoder input. 2x watchdogs and
SysTick timer
&"'!
LQFP100 (14 × 14 mm)
LQFP144 (20 × 20 mm)
LQFP176 (24 × 24 mm)
LQFP208 (28 × 28 mm)
UFBGA169 (7 × 7 mm)
UFBGA176 (10 x 10 mm)
TFBGA216 (13 x 13 mm)
WLCSP168
• Debug mode
– SWD & JTAG interfaces
– Cortex®-M4 Trace Macrocell™
• Up to 161 I/O ports with interrupt capability
– Up to 157 fast I/Os up to 90 MHz
– Up to 159 5 V-tolerant I/Os
• Up to 21 communication interfaces
– Up to 3 × I2C interfaces (SMBus/PMBus)
– Up to 4 USARTs and 4 UARTs (11.25 Mbit/s,
ISO7816 interface, LIN, IrDA, modem control)
– Up to 6 SPIs (45 Mbits/s), 2 with muxed full-
duplex I2S for audio class accuracy via internal
audio PLL or external clock
– 1 x SAI (serial audio interface)
– 2 × CAN (2.0B Active)
– SDIO interface
• Advanced connectivity
– USB 2.0 full-speed device/host/OTG controller
with on-chip PHY
– USB 2.0 high-speed/full-speed device/host/OTG
controller with dedicated DMA, on-chip full-
speed PHY and ULPI
– Dedicated USB power rail enabling on-chip
PHYs operation throughout the entire MCU
power supply range
– 10/100 Ethernet MAC with dedicated DMA:
supports IEEE 1588v2 hardware, MII/RMII
• 8- to 14-bit parallel camera interface up to
54 Mbytes/s
• True random number generator
• CRC calculation unit
• RTC: subsecond accuracy, hardware calendar
• 96-bit unique ID
Table 1. Device summary
Reference
Part numbers
STM32F469xx
STM32F469AE, STM32F469AG, STM32F469AI
STM32F469BE, STM32F469BG, STM32F469BI
STM32F469IE, STM32F469IG, STM32F469II
STM32F469NE, STM32F469NG, STM32F469NI
STM32F469VE, STM32469VG, STM32469VI
STM32F469ZE, STM32469ZG, STM32469ZI
March 2016
This is information on a product in full production.
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STM32F469xx
Contents
5.3.25
5.3.26
5.3.27
5.3.28
5.3.29
5.3.30
5.3.31
5.3.32
5.3.33
5.3.34
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
Reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
DAC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
FMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
Quad-SPI interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 184
Camera interface (DCMI) timing specifications . . . . . . . . . . . . . . . . . . 185
LCD-TFT controller (LTDC) characteristics . . . . . . . . . . . . . . . . . . . . . 186
SD/SDIO MMC card host interface (SDIO) characteristics . . . . . . . . . 188
RTC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
6 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
6.1 LQFP100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
6.2 LQFP144 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194
6.3 WLCSP168 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
6.4 UFBGA169 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199
6.5 LQFP176 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
6.6 UFBGA176+25 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . 205
6.7 LQFP208 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
6.8 TFBGA216 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .211
6.9 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213
7 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
Appendix A Recommendations when using internal reset OFF . . . . . . . . . . . 215
A.1 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215
8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216
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List of figures
Figure 93.
Figure 94.
Figure 95.
Figure 96.
Figure 97.
Figure 98.
ultra fine pitch ball grid array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205
UFBGA176+25 - 201-ball, 10 x 10 mm, 0.65 mm pitch, ultra fine pitch ball
grid array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206
LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 207
LQFP208 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209
LQFP208 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
TFBGA216 - thin fine pitch ball grid array 13 × 13 × 0.8mm, package outline . . . . . . . . . 211
TFBGA216 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212
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| PDF Descargar | [ Datasheet STM32469VI.PDF ] | |
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