PDF 9ZML1232 Data sheet ( Hoja de datos )

Número de pieza	9ZML1232
Descripción	2:12 LOW POWER DIFFERENTIAL Z-BUFFER MUX
Fabricantes	IDT
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No Preview Available ! 2:12 LOW POWER DIFFERENTIAL Z-BUFFER MUX FOR PCIE AND QPI/UPI DATASHEET 9ZML1232 General Description The 9ZML1232 is a 2-input/12-output differential mux for use in servers. It meets the demanding DB1200ZL performance specifications and utilizes Low-Power HCSL-compatible outputs to reduce power consumption and termination components. It is suitable for PCI-Express Gen1/2/3 or QPI/UPI applications, and uses a fixed external feedback to maintain low drift for demanding QPI applications. Recommended Application Clock Mux for Romley, Grantley and Purley Servers Output Features • 12 - Low-Power (LP) HCSL Output Pairs Block Diagram y Features/Benefits • Fixed feedback path; 0ps input-to-output delay • 9 Selectable SMBus addresses; multiple devices can share same SMBus segment • Separate VDDIO for outputs; allows maximum power savings • PLL or bypass mode; PLL can dejitter incoming clock • Hardware or Software-selectable PLL BW; minimizes jitter peaking in downstream PLL's • Spread spectrum compatible; tracks spreading input clock for EMI reduction • SMBus Interface; unused outputs can be disabled • Differential outputs are Low/Low in power down; maximum power savings Key Specifications • Cycle-to-cycle jitter <50ps • Output-to-output skew <65 ps • Input-to-output delay: Fixed at 0 ps • Input-to-output delay variation <50ps • Phase jitter: PCIe Gen3 <1ps rms • Phase jitter: QPI/UPI 9.6GB/s <0.2ps rms y OE(11:0)# DIF_INB DIF_INB# DIF_INA DIF_INA# HIBW_BYPM_LOBW# SEL_A_B# CKPWRGD/PD# SMB_A0_tri SMB_A1_tri SMBDAT SMBCLK Logic Z-PLL (SS Compatible) FBOUT_NC DIF(11:0) IDT® 2:12 LOW POWER DIFFERENTIAL Z-BUFFER MUX FOR PCIE AND QPI/UPI 1 9ZML1232 REV E 112015 1 page 9ZML1232 2:12 LOW POWER DIFFERENTIAL Z-BUFFER MUX FOR PCIE AND QPI/UPI Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the 9ZML1232. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. PARAMETER SYMBOL CONDITIONS 3.3V Core Supply Voltage VDDA, R 3.3V Logic Supply Voltage VDD I/O Supply Voltage VDDIO Input Low Voltage VIL Input High Voltage VIH Except for SMBus interface Input High Voltage VIHSMB SMBus clock and data pins Storage Temperature Ts Junction Temperature Tj Input ESD protection ESD prot Human Body Model 1Guaranteed by design and characterization, not 100% tested in production. 2 Operation under these conditions is neither implied nor guaranteed. MIN GND-0.5 -65 2000 TYP MAX 4.6 4.6 4.6 VDD+0.5V 5.5V 150 125 UNITS NOTES V 1,2 V 1,2 V 1,2 V1 V1 V1 °C 1 °C 1 V1 Electrical Characteristics–DIF_IN Clock Input Parameters TA = TCOM; Supply Voltage VDD/VDDA = 3.3 V +/-5%, VDDIO = 1.05 to 3.3V +/-5%. See Test Loads for Loading Conditions PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES Input Crossover Voltage - DIF_IN Input Swing - DIF_IN VCROSS VSWING Cross Over Voltage Differential value 150 900 mV 1 300 mV 1 Input Slew Rate - DIF_IN dv/dt Measured differentially 0.4 8 V/ns 1,2 Input Leakage Current Input Duty Cycle IIN dtin VIN = VDD , VIN = GND Measurement from differential wavefrom -5 45 5 uA 55 % 1 Input Jitter - Cycle to Cycle JDIFIn Differential Measurement 1 Guaranteed by design and characterization, not 100% tested in production. 2Slew rate measured through +/-75mV window centered around differential zero 0 125 ps 1 IDT® 2:12 LOW POWER DIFFERENTIAL Z-BUFFER MUX FOR PCIE AND QPI/UPI 5 9ZML1232 REV E 112015 5 Page 9ZML1232 2:12 LOW POWER DIFFERENTIAL Z-BUFFER MUX FOR PCIE AND QPI/UPI DIF Reference Clock Common Recommendations for Differential Routing Dimension or Value L1 length, route as non-coupled 50ohm trace 0.5 max L2 length, route as non-coupled 50ohm trace 0.2 max L3 length, route as non-coupled 50ohm trace 0.2 max Rs (100 ohm differential traces) 33 Rs (85 ohm differential traces) 27 Down Device Differential Routing L4 length, route as coupled microstrip 100ohm differential trace 2 min to 16 max L4 length, route as coupled stripline 100ohm differential trace 1.8 min to 14.4 max Differential Routing to PCI Express Connector L4 length, route as coupled microstrip 100ohm differential trace 0.25 to 14 max L4 length, route as coupled stripline 100ohm differential trace 0.225 min to 12.6 max Unit Figure inch 1 inch 1 inch 1 ohm 1 ohm 1 inch 1 inch 1 inch 2 inch 2 Figure 1: Down Device Routing LP-HCSL Output L1 Rs L1' Rs L2 L2' L4 L4' PCI Express Down Device REF_CLK Input Figure 2: PCI Express Connector Routing LP-HCSL Output L1 L2 Rs L1' L2' Rs L4 L4' PCI Express Add-in Board REF_CLK Input IDT® 2:12 LOW POWER DIFFERENTIAL Z-BUFFER MUX FOR PCIE AND QPI/UPI 11 9ZML1232 REV E 112015 11 Page

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