DataSheet39.com

What is GS81302TT10E?

This electronic component, produced by the manufacturer "GSI Technology", performs the same function as "144Mb SigmaDDR-II+ Burst of 2 SRAM".


GS81302TT10E Datasheet PDF - GSI Technology

Part Number GS81302TT10E
Description 144Mb SigmaDDR-II+ Burst of 2 SRAM
Manufacturers GSI Technology 
Logo GSI Technology Logo 


There is a preview and GS81302TT10E download ( pdf file ) link at the bottom of this page.





Total 30 Pages



Preview 1 page

No Preview Available ! GS81302TT10E datasheet, circuit

GS81302TT07/10/19/37E-450/400/350/333/300
165-Bump BGA
Commercial Temp
Industrial Temp
144Mb SigmaDDRTM-II+
Burst of 2 SRAM
450 MHz–300 MHz
1.8 V VDD
1.8 V or 1.5 V I/O
Features
• 2.0 Clock Latency
• Simultaneous Read and Write SigmaDDR™ Interface
• Common I/O bus
• JEDEC-standard pinout and package
• Double Data Rate interface
• Byte Write controls sampled at data-in time
• Burst of 2 Read and Write
• Dual-Range On-Die Termination (ODT) on Data (D), Byte
Write (BW), and Clock (K, K) inputs
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation with self-timed Late Write
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• Data Valid pin (QVLD) Support
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
SigmaDDRFamily Overview
The GS81302TT07/10/19/37E are built in compliance with the
SigmaDDR-II+ SRAM pinout standard for Common I/O
synchronous SRAMs. They are 150,994,944-bit (144Mb)
SRAMs. The GS81302TT07/10/19/37E SigmaDDR-II+
SRAMs are just one element in a family of low power, low
voltage HSTL I/O SRAMs designed to operate at the speeds
needed to implement economical high performance
networking systems.
Clocking and Addressing Schemes
The GS81302TT07/10/19/37E SigmaDDR-II+ SRAMs are
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
inputs, not differential inputs to a single differential clock input
buffer.
Each internal read and write operation in a SigmaDDR-II+ B2
RAM is two times wider than the device I/O bus. An input data
bus de-multiplexer is used to accumulate incoming data before
it is simultaneously written to the memory array. An output
data multiplexer is used to capture the data produced from a
single memory array read and then route it to the appropriate
output drivers as needed. Therefore, the address field of a
SigmaDDR-II+ B2 RAM is always one address pin less than
the advertised index depth (e.g., the 16M x 8 has an 8M
addressable index).
Parameter Synopsis
tKHKH
tKHQV
-450
2.2 ns
0.45 ns
-400
2.5 ns
0.45 ns
-350
2.86 ns
0.45 ns
-333
3.0 ns
0.45 ns
-300
3.3 ns
0.45 ns
Rev: 1.00a 11/2011
1/30
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2011, GSI Technology

line_dark_gray
GS81302TT10E equivalent
GS81302TT07/10/19/37E-450/400/350/333/300
4M x 36 SigmaDDR-II+ SRAM—Top View
1 2 3 4 5 6 7 8 9 10 11
A CQ SA SA R/W BW2 K BW1 LD SA SA CQ
B
NC DQ27 DQ18 SA BW3
K
BW0
SA
NC
(288Mb)
NC
DQ8
C NC NC DQ28 VSS SA NC SA VSS NC DQ17 DQ7
D NC DQ29 DQ19 VSS VSS VSS VSS VSS NC NC DQ16
E
NC
NC
DQ20
VDDQ
VSS
VSS
VSS VDDQ NC DQ15 DQ6
F
NC
DQ30 DQ21
VDDQ
VDD
VSS
VDD VDDQ NC
NC DQ5
G
NC
DQ31 DQ22
VDDQ
VDD
VSS
VDD VDDQ NC
NC DQ14
H
Doff
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
ZQ
J
NC
NC
DQ32
VDDQ
VDD
VSS
VDD VDDQ NC DQ13 DQ4
K
NC
NC
DQ23
VDDQ
VDD
VSS
VDD VDDQ NC DQ12 DQ3
L
NC
DQ33
DQ24
VDDQ
VSS
VSS
VSS VDDQ NC
NC DQ2
M
NC
NC DQ34 VSS VSS VSS VSS
VSS
NC
DQ11
DQ1
N
NC DQ35 DQ25 VSS
SA
SA
SA
VSS NC
NC DQ10
P NC NC DQ26 SA SA QVLD SA SA NC DQ9 DQ0
R
TDO TCK
SA
SA
SA ODT SA
SA
SA TMS TDI
11 x 15 Bump BGA—15 x 17 mm2 Body—1 mm Bump Pitch
Notes:
3. BW0 controls writes to DQ0:DQ8; BW1 controls writes to DQ9:DQ17; BW2 controls writes to DQ18:DQ26; BW3 controls writes to
DQ27:DQ35
4. B9 is the expansion address.
Rev: 1.00a 11/2011
5/30
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2011, GSI Technology


line_dark_gray

Preview 5 Page


Part Details

On this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for GS81302TT10E electronic component.


Information Total 30 Pages
Link URL [ Copy URL to Clipboard ]
Download [ GS81302TT10E.PDF Datasheet ]

Share Link :

Electronic Components Distributor


An electronic components distributor is a company that sources, stocks, and sells electronic components to manufacturers, engineers, and hobbyists.


SparkFun Electronics Allied Electronics DigiKey Electronics Arrow Electronics
Mouser Electronics Adafruit Newark Chip One Stop


Featured Datasheets

Part NumberDescriptionMFRS
GS81302TT107EThe function is 144Mb SigmaDDR-II+ Burst of 2 SRAM. GSI TechnologyGSI Technology
GS81302TT10EThe function is 144Mb SigmaDDR-II+ Burst of 2 SRAM. GSI TechnologyGSI Technology
GS81302TT10GEThe function is 144Mb SigmaDDR-II+ Burst of 2 SRAM. GSI TechnologyGSI Technology

Semiconductors commonly used in industry:

1N4148   |   BAW56   |   1N5400   |   NE555   |  

LM324   |   BC327   |   IRF840  |   2N3904   |  



Quick jump to:

GS81     1N4     2N2     2SA     2SC     74H     BC     HCF     IRF     KA    

LA     LM     MC     NE     ST     STK     TDA     TL     UA    



Privacy Policy   |    Contact Us     |    New    |    Search