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PDF SP3001 Data sheet ( Hoja de datos )
| Número de pieza | SP3001 | |
| Descripción | Low Capacitance ESD Protection Array | |
| Fabricantes | Littelfuse | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de SP3001 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
HF RoHS Pb GREEN SP3001 Lead-Free/Green Series
Description
The SP3001 has ultra low capacitance rail-to rail diodes
with an additional zener diode fabricated in a proprietary
silicon avalanche technology to protect each I/O pin
providing a high level of protection for electronic equipment
that may experience destructive electrostatic discharges
(ESD). These robust diodes can safely absorb repetitive
ESD strikes at the maximum level specified in the IEC
61000-4-2 international standard (Level 4, ±8kV contact
discharge) without performance degradation. Their very low
loading capacitance also makes them ideal for protecting
high speed signal pins such as HDMI, DVI, USB2.0, and
IEEE 1394.
Pinout
I/O 1
GND
I/O 2
I/O 4
VCC
I/O 3
Features
t-PXDBQBDJUBODFPG
0.65pF (TYP) per I/O
t&4%QSPUFDUJPOPGL7
contact discharge, ±15kV
air discharge,
(IEC61000-4-2)
t&'5QSPUFDUJPO
IEC61000-4-4,
40A (5/50ns)
t-PXMFBLBHFDVSSFOUPG
0.5μA (MAX) at 5V
t4NBMM4$QBDLBHF
saves board space
t-JHIUOJOH1SPUFDUJPO
IEC61000-4-5, 2.5A
(8/20μs)
Functional Block Diagram
I/O2 VCC
I/O4
Applications
t $PNQVUFS1FSJQIFSBMT
t.PCJMF1IPOFT
t1%"T
t%JHJUBM$BNFSBT
t/FUXPSL)BSEXBSF1PSUT
t5FTU&RVJQNFOU
t.FEJDBM&RVJQNFOU
I/O1 GND I/O3
-JGF4VQQPSU/PUF
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
39
Revised: February 9, 2010
SP3001 Lead-Free/Green Series
1 page  
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Package Dimensions - SC70-6
ee
654
E HE
12
B
D
3
A2 A
A1
C
Solder Pad Layout
L
Package
Pins
JEDEC
A
A1
A2
B
c
D
E
e
HE
L
SC70-6
6
MO-203 Issue A
Millimeters
Inches
Min Max Min Max
0.80
1.10
0.031
0.043
0.00
0.10
0.000
0.004
1.00
0.028
0.039
0.15
0.30
0.006
0.012
0.08
0.25
0.003
0.010
1.85
2.25
0.089
1.15
1.35
0.045
0.053
0.65 BSC
0.026 BSC
2.00
2.40
0.094
0.26 0.46 0.010 0.018
Part Numbering System
SP3001-04 J T G
Silicon
Protection
Array
Series
Number of Channels
-04 = 4 channel
G= Green
T= Tape & Reel
Package
J = SC70-6, 3000 quantity
Part Marking System
DX4
DX4
Product Series
D = SP3001 series
Number of Channels
Assembly Site
(varies)
Ordering Information
Part Number
SP3001-04JTG
Package
4$
Product Characteristics
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Body Material
Silicon
Molded Epoxy
Flammability
UL94-V-0
/PUFT
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Marking
DX4
Min. Order Qty.
3000
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
43
Revised: February 9, 2010
SP3001 Lead-Free/Green Series
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet SP3001.PDF ] | |
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