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What is VDZ3.9B?

This electronic component, produced by the manufacturer "ROHM Semiconductor", performs the same function as "Zener diode".


VDZ3.9B Datasheet PDF - ROHM Semiconductor

Part Number VDZ3.9B
Description Zener diode
Manufacturers ROHM Semiconductor 
Logo ROHM Semiconductor Logo 


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Diodes
Zener diode
VDZ3.9B
zApplication
Voltage regulation
zExternal dimensions (Unit : mm)
㪇㪅㪍㫧㪇㪅㪇㪌
㪇㪅㪈㪊㫧㪇㪅㪇㪊
zFeatures
1) Ultra small mold type (VMD2).
2) High reliability.
3) By chip-mounter, automatic mounting
is possible.
zStructure
Silicon Epitaxial Planer
㪇㪅㪉㪎㫧㪇㪅㪇㪊
㪇㪅㪌㫧㪇㪅㪇㪌
㪩㪦㪟㪤㩷㪑㩷㪭㪤㪛㪉
㪻㫆㫋㩷㩿㫐㪼㪸㫉㩷㫎㪼㪼㫂㩷㪽㪸㪺㫋㫆㫉㫐㪀 㪜㪯㪅㩷㩷㪭㪛㪱㪊㪅㪍㪙
zTaping specification (Unit : mm)
㪋㫧㪇㪅㪈
㪉㫧㪇㪅㪇㪌
㱢㪈㪅㪌㪂㪇㪅㪈
䇭䇭䇭䇭䇭㪇
VDZ3.9B
zLand size figure (Unit : mm)
㪇㪅㪌
㪭㪤㪛㪉
zStructure
㪇㪅㪈㪏㫧㪇㪅㪇㪌
㪇㪅㪎㪍㫧㪇㪅㪈
zAbsolute maximum ratings (Ta=25qC)
Parameter
Symbol
Power dissipation
P
Junction temperature
Tj
Storage temperature
Tstg
Operating temperature
Topr
㪋㫧㪇㪅㪈
Limits
100
150
-55 to +150
-55 to +150
㪉㫧㪇㪅㪇㪌
㱢㪇㪅㪌
Unit
mW
㪇㪅㪊
㪇㪅㪍㪌㫧㪇㪅㪇㪌
Rev.B
1/4

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VDZ3.9B equivalent
Datasheet
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU CHINA
CLASS
CLASS
CLASS
CLASSb
CLASS
CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001


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Part Details

On this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for VDZ3.9B electronic component.


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