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PDF STL6118A Data sheet ( Hoja de datos )
| Número de pieza | STL6118A | |
| Descripción | 300mA Low Dropout Low Noise LDO | |
| Fabricantes | Semtron | |
| Logotipo |  |
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■DESCRIPTION
The STL6118A series is a low dropout, low
noise, low quiescent current linear regulator that
operations in the input voltage range from +2.2V to
+7.0V and delivers 300mA output current.
The high-accuracy output voltage is preset at an
internally trimmed voltage 2.5V or 3.3V. Other
output voltages can be mask-optioned from 1.2V to
5.0V with 100mV increment, except STL6118A-LL
which has 2.85V output voltage.
The STL6118A consists of a 1.25V band-gap
reference, an error amplifier, and a P-channel pass
transistor. Other features include short-circuit
protection and thermal shutdown protection. The
STL6118A devices are available in SOT-23, SOT-
89.
STL6118A
300mA Low Dropout Low Noise LDO
■FEATURE
Low Current Consumption: 15μA(Typ.)
Short Circuit Protection: 150mA
Typical Dropout Voltage: 125mV@100mA(Typ.)
Maximum Output Current: 300mA
Output Current Limit Protection: 500mA
Thermal Overload Shutdown Protection
Low ESR Capacitor Compatible.
■APPLICATIONS
Battery Powered Equipment.
Cameras, Video Cameras
Portable Games
Radio Communication Equipment
Mobile Phone, Coreless Phone
■PIN CONFIGURATION
VOUT
VIN
TOP VIEW
SOT-89
GND
■PART MARKING INFORMATION
STL6118A-XX X-XX X
Lead Plating Code
Handling Code
Package Code
Lead Plating Code
Voltage Code
G : Lead-free product.
This product is RoHS compliant
Handling Code
TR : Tape&Reel TB : Tape&Box
Package Code
K : SOT-89
S : SOT-23
Voltage Code
XX : 12 / 15 / 18 / 25 / 285 / 30 / 33 / 36
GND
VOUT
VIN
TOP VIEW
SOT-23
Marking:
2AVXX
2A : STL6118A
V : 5=1.2V, 8=1.5V, A=1.8V
G=2.5V, L=2.85V, M=3.0V
Q=3.3V, V=3.6V
XX : Date code
STL6118A Rev.1.0
Copyright © Semtron Microtech Corp.
1
www.semtron-micro.com
1 page  
continuous operation, the maximum operating
junction temperature rating of TJ=+125°C should not
be exceeded.
◆Operating Region and Power Dissipation
Maximum power dissipation of the STL6118A
depends on the thermal resistance of the case and
circuit board, the temperature difference between
the die junction and ambient air, and the rate of
airflow. The power dissipation across the devices is
P = IOUT x (VIN-VOUT). The resulting maximum power
dissipation is:
STL6118A
PMAX=(TJ-TA)/θJC+θJA=(TJ-TA)/θJA
Where (TJ-TA) is the temperature difference
between the STL6118A die junction and the
surrounding air, θJC is the thermal resistance of the
package chosen, and θCA is the thermal resistance
through the printed circuit board, copper traces and
other materials to the surrounding air. For better
heat-sinking, the copper area should be equally
shared between the VIN, VOUT, and GND pins.
STL6118A Rev.1.0
Copyright © Semtron Microtech Corp.
5
www.semtron-micro.com
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet STL6118A.PDF ] | |
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